Low-Expansion Fe-Ni Alloy Microstructure for Subzero Stability

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current low thermal expansion alloys, such as Super Invar and Invar, face limitations in achieving zero thermal expansion and low temperature stability at temperatures below -100°C, with Super Invar's martensite structure forming at low temperatures increasing thermal expansion and Invar's coefficient being too high for high precision applications.

Innovation Solution

A low thermal expansion alloy with a composition of Fe-36%Ni, reduced C, Si, and Mn content, and a Co content less than 2%, combined with a refined microstructure of secondary dendrite arm spacing of 5 µm or less, achieved through laser or electron beam additive manufacturing, to maintain stability equivalent to Invar alloy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If Ni is replaced by Co in Fe-Ni alloy to reduce thermal expansion coefficient, then thermal expansion coefficient decreases to 1 ppm/°C or less, but austenite is destabilized and martensite structure generates at low temperature, causing thermal expansion coefficient to sharply increase

Engineering Contradiction:
Improvethermal expansion coefficientVSAvoidlow temperature stability
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

The invention changes the chemical composition parameters by strictly limiting Co content to less than 2% (preferably 0.01-1%) and controlling C, Si, and Mn content to specific ranges. This parameter optimization prevents austenite destabilization while achieving low thermal expansion, resolving the contradiction between thermal expansion reduction and low temperature stability.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention applies local quality control by refining the microstructure to achieve secondary dendrite arm spacing of 5 µm or less through rapid solidification processing. This localized microstructural refinement ensures uniform austenite phase stability throughout the material, preventing martensite generation at low temperatures while maintaining low thermal expansion properties.

Inventive Principle:
Principle #3Local quality

2Reliability

If Fe-36%Ni alloy (Invar) is used to maintain low temperature stability with Ms point of -196°C or lower, then low temperature stability is maintained, but thermal expansion coefficient is 1 to 2 ppm/°C which is higher than required for high precision applications

Engineering Contradiction:
Improvelow temperature stabilityVSAvoidthermal expansion coefficient
Core Design Contradiction:
ReliabilityVSMeasurement precision

Solution Approach 1:

The invention optimizes composition parameters by setting Ni content to 34-37% (slightly lower than conventional Invar's 36%), Co to less than 2%, and strictly controlling C, Si, and Mn content. This compositional optimization achieves thermal expansion coefficient of 0 ± 0.2 ppm/°C while maintaining Ms point of -196°C or lower, simultaneously satisfying both precision and low temperature stability requirements.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention creates a composite alloy system combining Fe, Ni, and small amounts of Co with controlled impurities (C, Si, Mn). This composite composition achieves synergistic effects where the base Fe-Ni-Invar structure provides low temperature stability while the optimized Co content and impurity control reduce thermal expansion to near-zero, fulfilling both contradictory requirements.

Inventive Principle:
Principle #40Composite materials

3Ease of manufacture

If conventional casting method is used to produce Invar alloy, then manufacturing process is simple, but secondary dendrite arm spacing is larger than 5 µm, resulting in insufficient thermal expansion control and low temperature stability

Engineering Contradiction:
Improvemanufacturing process simplicityVSAvoidsecondary dendrite arm spacing
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The invention changes the processing parameters by applying rapid solidification techniques to achieve cooling rates that produce secondary dendrite arm spacing of 5 µm or less. This microstructural refinement, combined with optimized composition, ensures thermal expansion coefficient of 0 ± 0.2 ppm/°C and Ms point of -196°C or lower, achieving high precision while maintaining manufacturing feasibility through established rapid solidification processes.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The alloy achieves an average thermal expansion coefficient of 0 ± 0.2 ppm/°C between 100°C and -70°C, providing low temperature stability and minimizing heat deformation, suitable for precision devices in aerospace and measurement instruments.

Implementation Method 1

irradiating alloy powder having specific composition with a laser or electron beam to melt and rapidly solidify the powder

Methodology Applied
Scientific EffectRapid solidification:

Implementation Method 2

irradiating alloy powder having specific composition with a laser or electron beam to melt and rapidly solidify the powder

Methodology Applied
Scientific EffectLaser heating: Laser

Implementation Method 3

When the thermal expansion coefficient is zero, heat deformation does not occur with temperature change

Methodology Applied
Scientific EffectPhase stability:

Implementation Method 4

the thermal expansion coefficient in the temperature range between 100°C and -70°C falls within the range of 0 ± 0.2 ppm/°C

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentEP3950998B1Low thermal expansion alloy having excellent low temperature stability and method for producing the same
Publication Date: 2023.08.23 NIPPON CHUZO
  • EP3950998B1 patent drawingFigure 1~2
  • EP3950998B1 patent drawingFigure 3~4
  • EP3950998B1 patent drawingFigure 5~6

AI summary

Provided is a low thermal expansion alloy that contains, in mass%, not more than 0.015% of C, not more than 0.10% of Si, not more than 0.15% of Mn, 35.0-37.0% of Ni, and less than 2.0% of Co. Ni+0.8Co is 35.0-37.0%, and the remaining portion is Fe and unavoidable impurities. The low thermal expansion alloy has a solidification structure in which the secondary dendrite-arm spacing is 5 µm or less, has an average thermal expansion coefficient in a range of 0±0.2 ppm/°C at 100°C to -70°C, and has an Ms point of -196°C or less.