Fe-Ni-P-RE Alloy Plating for Inductor Magnetic Loss
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Solution Overview
Problem
Existing Fe—Ni thin film materials used in magnetic core applications for inductor devices in microelectronics suffer from high energy consumption and rapid decrease in inductance at high-frequency applications, limiting their performance.
Innovation Solution
A Fe—Ni—P-RE multicomponent alloy plating layer is developed through electroplating, with controlled composition of Fe, Ni, P, and rare earth elements (La, Ce, Pr, Nd, Eu, Gd, and Tb), using a plating solution comprising ferrite, nickel salts, and complexing agents, allowing for adjustable magnetic and electrical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If Fe-Ni thin film materials are used as magnetic core in inductor devices, then thermal expansion and soft magnetic properties are improved, but energy consumption increases and inductance decreases rapidly at high frequencies
Solution Approach 1:
The patent creates a Fe-Ni-P-RE multicomponent alloy plating layer by combining four elements (Fe, Ni, P, and rare earth elements) into a composite material system. This composite structure integrates the beneficial properties of each element: Fe and Ni provide thermal expansion control and soft magnetic properties, P reduces energy loss at high frequencies, and rare earth elements further enhance magnetic performance and stability, thereby resolving the contradiction between maintaining good magnetic properties and reducing energy consumption.
Solution Approach 2:
The patent systematically varies the composition parameters of the alloy plating layer, specifically controlling the mass percentages of Fe (20-65%), Ni (25-70%), P (balance), and RE (2-25%). By optimizing these compositional parameters, the material achieves both improved thermal expansion matching and soft magnetic properties while simultaneously reducing high-frequency energy loss and inductance decrease, thus resolving the technical contradiction through parameter optimization.
2Ease of manufacture
If electroplating method is used instead of magnetron sputtering or CVD, then equipment investment and operation cost are reduced, but control over material composition and properties may be limited
Solution Approach 1:
The patent employs electroplating with carefully controlled parameters including plating solution composition (ferrite 0.01-0.09 mol/L, nickel salt 0.01-0.09 mol/L, complexing agent 0.1-0.2 mol/L, pH 2-5, temperature 45-70°C), current density (3.0-9.0 A/dm³), or voltage (-0.9 to -3.0 V). These parameter controls enable precise regulation of the alloy plating layer composition and properties, achieving manufacturing precision comparable to vacuum deposition methods while maintaining the cost advantages of electroplating.
Solution Approach 2:
The patent uses complexing agents (such as Na3C6H5O7 at 0.1-0.2 mol/L) as intermediaries in the plating solution to mediate the deposition process. These complexing agents control the release and deposition of metal ions, enabling precise control over the composition and structure of the Fe-Ni-P-RE alloy plating layer while using the simple and cost-effective electroplating method, thus bridging the gap between ease of manufacture and manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the magnetic performance, reduces energy loss at high frequencies, and improves corrosion resistance, enabling better thermal expansion and electrical properties, thus expanding the application of Fe—Ni alloy materials.
Implementation Method 1
the electrodeposition method is preferred in the industries due to its advantages of low upfront investment on equipment, easy and feasible operation, short cycle of material preparation, high efficiency, low operation cost
Data Source
AI summary
An Fe—Ni—P-RE multicomponent alloy plating layer, electrodeposition preparation method, and plating application. The alloy plating layer obtained via electrodeposition contains elements Fe, Ni, P and RE, with the following mass percentages Fe— 16%-65%, Ni— 25%-70%, combined Fe and Ni— 63%-91%, RE 1.6%-25%, and the balance being P. The plating solution mainly contains the following components: ferrous salt, nickel salt, NaH2PO2, RECl3, H3BO3 and Na3C6H5O7. A multicomponent alloy plating layer of different components can be obtained by adjusting the main salt and complexing agent in the plating solution and by adjusting the process Enabled is controllable adjustment to the components of the obtained plating layer while saving costs, improved characteristics such as the thermal expansion coefficient, electrical property, magnetic property, etc., and products and methods very suitable for applications in the field of micro-electronics.