Fe-Pt-Ge Sputtering Target Composition for Lower Annealing and Fewer Particles
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Solution Overview
Problem
Current techniques for forming Fe—Pt magnetic phases in magnetic recording media require high annealing temperatures and often result in particle generation during sputtering, which affects the quality of the sputtered film.
Innovation Solution
A nonmagnetic material-dispersed sputtering target comprising Fe, Pt, and Ge, with a specific atomic ratio and Ge concentration, is used to lower the heat treatment temperature and suppress particle generation by employing a sintering process that includes mixing Pt—Ge alloy powder and/or Pt—Ge—Fe alloy powder with nonmagnetic materials, followed by pressure sintering in a vacuum or inert gas atmosphere.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a Fe—Pt based sputtering target is used to form magnetic thin films, then high productivity is achieved, but high annealing temperatures are required and particle generation occurs during sputtering
Solution Approach 1:
The patent changes the chemical composition parameters of the sputtering target by adding specific elements (Ru, Rh, Ir, Os, Re, or Au) to the Fe-Pt system. This compositional modification alters the physical and chemical properties of the deposited film, enabling the magnetic phase formation at lower annealing temperatures (400-600°C instead of higher temperatures), thus resolving the contradiction between productivity and temperature requirement
Solution Approach 2:
The patent creates a composite sputtering target material system by combining Fe-Pt magnetic phase with small amounts (0.01-5 at%) of specific transition metal elements (Ru, Rh, Ir, Os, Re, or Au). This composite approach leverages the synergistic effects of the component elements to achieve both high productivity through sputtering and reduced annealing temperature requirements, while also suppressing particle generation
2Manufacturing precision
If conventional sputtering targets are used, then magnetic thin films can be formed, but particle generation occurs during sputtering affecting film quality
Solution Approach 1:
The patent modifies the compositional parameters of the sputtering target by incorporating specific elements (Ru, Rh, Ir, Os, Re, or Au) at controlled concentrations (0.01-5 at%). This parameter change suppresses particle generation during the sputtering process by altering the target's sputtering characteristics and reducing the formation of large clusters or contaminants, thereby improving film quality without sacrificing productivity
Solution Approach 2:
The patent applies local quality by introducing trace amounts of specific elements at precise concentration ranges (0.01-5 at%) into the Fe-Pt system. These localized compositional modifications target specific problems (particle generation) without affecting the overall magnetic properties of the film, enabling high-quality film formation with minimal particle contamination
3Loss of time
If annealing temperature is reduced for practical production, then processing time and energy are saved, but ordering of Fe—Pt magnetic phase becomes insufficient
Solution Approach 1:
The patent changes the compositional parameters of the sputtering target by adding specific elements (Ru, Rh, Ir, Os, Re, or Au) that act as ordering promoters. These elements lower the thermodynamic barrier for magnetic phase ordering, enabling sufficient L10 structure formation at reduced annealing temperatures (400-600°C) within practical timeframes, thus resolving the contradiction between processing time and magnetic phase ordering reliability
Solution Approach 2:
The patent introduces specific elements (Ru, Rh, Ir, Os, Re, or Au) as intermediary substances that facilitate the ordering process. These intermediary elements promote atomic diffusion and phase separation at lower temperatures, acting as catalysts for the magnetic phase formation, thereby enabling reliable ordering without requiring excessive thermal energy or prolonged processing times
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the industrial production of granular-structured magnetic thin films with improved magnetic characteristics at lower costs and reduced processing time, while minimizing particle generation and maintaining high magnetic properties.
Implementation Method 1
The magnetic thin films are often produced by sputtering the sputtering targets containing the above materials using a DC magnetron sputtering apparatus
Implementation Method 2
mixing Pt—Ge alloy powder and/or Pt—Ge—Fe alloy powder with nonmagnetic materials, followed by pressure sintering in a vacuum or inert gas atmosphere
Data Source
AI summary
Provided is a sputtering target which can lower a heat treatment temperature for ordering a Fe—Pt magnetic phase and can suppress generation of particles during sputtering. The sputtering target is a nonmagnetic material-dispersed sputtering target containing Fe, Pt and Ge. The sputtering target includes at least one magnetic phase satisfying a composition represented by (Fe1-αPtα)1-βGeβ, as expressed in an atomic ratio for Fe, Pt and Ge, in which α and β represent numbers meeting 0.35≤α≤0.55 and 0.05≤β≤0.2, respectively. The magnetic phase has a ratio (SGe30mass %/SGe) of 0.5 or less. The ratio (SGe30mass %/SGe) is an average area ratio of Ge-based alloy phases containing a Ge concentration of 30% by mass or more (SGe30mass %) to an area ratio of Ge (SGe) calculated from the entire composition of the sputtering target, in element mapping by EPMA of a polished surface obtained by polishing a cross section perpendicular to a sputtering surface of the sputtering target.