Federated RL Defect Classification for SEM Inspection
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Solution Overview
Problem
Current defect detection tools in semiconductor inspection, particularly those using scanning electron microscopy (SEM), face limitations due to rule-based techniques, leading to misclassification of defects and increased engineering time.
Innovation Solution
A federated, reinforcement-learning (RL) machine learning system is developed for automatic defect detection and classification. This system involves a central model server providing an initial trained model to clients, who update their local models based on client-specific data and share weight parameters with the central server to form an updated global model.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If rule-based techniques are used for defect classification and detection, then the inspection process is simple to implement, but misclassification of defects occurs and engineering time increases
Solution Approach 1:
The patent replaces rule-based techniques (mechanical/systematic approach) with machine learning models that use reinforcement learning. The ML models learn optimal defect classification strategies through iterative training with reward signals, substituting the rigid rule-based system with an adaptive intelligent system that improves accuracy while reducing manual engineering time for rule creation and maintenance.
Solution Approach 2:
The patent changes the fundamental parameters of the classification system by transitioning from fixed rules to dynamic machine learning models. The models adjust their internal parameters (weights and biases) based on training data and reinforcement learning feedback, enabling adaptive classification that reduces misclassification errors and decreases the time required for engineering adjustments.
2Reliability
If federated learning is implemented across multiple clients, then defect detection reliability improves through collaborative learning, but system complexity increases
Solution Approach 1:
The patent segments the centralized training process into distributed local training sessions at each client site. Each client trains ML models locally on their own data while contributing to the global model through federated learning. This segmentation improves reliability by leveraging diverse local datasets while managing complexity through modular, distributed architecture that eliminates the need for centralized data aggregation.
Solution Approach 2:
The patent introduces a federated learning coordination layer that acts as an intermediary between multiple clients and the global model. This intermediary manages model distribution, collects local model updates, and aggregates them into improved global models, thereby enabling collaborative learning across clients while abstracting the complexity of distributed coordination from individual clients.
3Manufacturing precision
If SEM inspection is performed on extremely small structures below 40 nm, then device scaling continues according to Moore's law, but inherent noise in e-beam makes accurate measurements difficult
Solution Approach 1:
The patent applies reinforcement learning where the ML models receive feedback in the form of reward signals based on measurement accuracy and defect classification correctness. This feedback mechanism enables the models to learn optimal measurement and classification strategies that compensate for e-beam noise, improving manufacturing precision by adaptively adjusting to noise conditions rather than being constrained by fixed thresholds.
Solution Approach 2:
The patent performs preliminary training of machine learning models on labeled defect data before actual inspection. This preliminary action allows the models to learn noise patterns and measurement optimization strategies in advance, enabling them to make accurate measurements on extremely small structures even when e-beam noise is present during actual inspection.
Data Source
AI summary
A method for training a local machine learning model is provided. The method includes receiving a scanning electron microscope (SEM) image of semiconductor features. The method additionally includes determining a location and dimensions of a bounding box within the SEM image. The method yet further includes determining, whether a defect feature exists within the bounding box, based on an unsupervised object detection process. The method also includes, if the defect feature exists within the bounding box, receiving positive rewards. The method also includes, if the defect feature does not exist within the bounding box, receiving negative rewards.


