Feedback Burn-in Device for IC Temperature Control
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Solution Overview
Problem
Existing burn-in oven systems face challenges with severe energy consumption, inaccurate temperature control, and the need for uniform IC types and conditions, leading to overloading, shutdowns, and inefficient burn-in operations due to non-uniform heat dissipation airflow and prolonged temperature stabilization in large enclosed chambers.
Innovation Solution
A feedback burn-in device with a burn-in rack, board, and unit that includes a horizontal ventilation passage, heat dissipation fin assembly, sensor, and external controller for automatic temperature feedback control, allowing independent and precise temperature management of each IC through controlled airflow and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat-dissipative airflow is blown directly toward ICs under test in a large-sized enclosed chamber, then temperature homogenization is achieved, but it takes a long time for the temperature to become steady and individual IC temperature control becomes difficult
Solution Approach 1:
The large-sized enclosed chamber is segmented into multiple independent test chambers, each capable of independent temperature control. This allows individual ICs to be tested under different temperature conditions simultaneously, eliminating the time delay associated with heating entire large chambers and enabling rapid temperature stabilization for each individual IC.
Solution Approach 2:
The system implements dynamic temperature control where each test chamber can independently adjust its temperature based on real-time feedback from temperature sensors. This dynamic adjustment capability allows the system to rapidly reach and maintain target temperatures for individual ICs without being constrained by the thermal inertia of a large enclosed chamber.
2Device complexity
If all ICs under test in the same layer are required to be of the same type and test condition for unified temperature control, then temperature control is simplified, but the test range and application are severely constrained
Solution Approach 1:
The burn-in oven is divided into multiple independent test chambers, each functioning as an autonomous temperature control zone. This segmentation enables different IC types and test conditions to be applied in different chambers simultaneously, greatly expanding test versatility while maintaining simple unified control within each chamber.
Solution Approach 2:
Each test chamber is designed with universal functionality to accommodate different IC types and test configurations while maintaining independent temperature control. This multi-functionality allows the system to handle diverse testing requirements across multiple chambers without increasing the complexity of individual chamber control.
3Manufacturing precision
If each IC under test is set in a heat-dissipative airflow of non-uniform temperature, then airflow circulation is simplified, but it is hard to ensure proper control and accuracy of the test temperature
Solution Approach 1:
Each test chamber is equipped with localized temperature control and airflow management systems that provide uniform temperature distribution specifically at the IC test location. Temperature sensors and heating elements are positioned to ensure uniform thermal conditions around each IC, while airflow is directed to provide consistent cooling without requiring complex circulation systems across the entire oven.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid and uniform temperature stabilization for individual ICs, reducing energy consumption and preventing overloading, while allowing for diverse IC types and conditions, thereby enhancing burn-in test accuracy and efficiency.
Implementation Method 1
the feedback burn-in unit having a function of automatic feedback control of a burn-in board environment temperature, tested IC temperature detection and tested IC burn-in temperature
Implementation Method 2
a heat-dissipation hot air is discharged from the burn-in board and a tested IC on each feedback burn-in unit into the horizontal ventilation passage
Implementation Method 3
the feedback burn-in unit having a function of automatic feedback control of a burn-in board environment temperature, tested IC temperature detection and tested IC burn-in temperature
Data Source
AI summary
A feedback burn-in device of a burn-in oven includes at least one burn-in rack disposed in the burn-in oven, at least one burn-in board, and at least one feedback burn-in unit. The burn-in rack is formed, in a top thereof, with at least one horizontal ventilation passage in communication with an interior of the burn-in rack. The horizontal ventilation passage has an end connected to at least one negative pressure zone or heat dissipation blower of the burn-in oven. The burn-in board is disposed in the interior of the burn-in rack. The burn-in board is connected to a socket to which at least one tested IC is connectable. The feedback burn-in unit is connected to the socket and the burn-in board. The feedback burn-in unit provide automatic feedback control for a burn-in board environment temperature, tested IC temperature detection, and a tested IC burn-in temperature, a dissipating airflow speed, and a burn-in board environment temperature, so as to discharge heat-dissipation hot air from the burn-in board and the tested IC of each feedback burn-in unit to the horizontal ventilation passage of the burn-in rack to be further discharge through one end of the horizontal ventilation passage to a negative pressure zone or a discharge blower of the burn-in oven, thereby forming a feedback burn-in device featuring automatic feedback burn-in and heat dissipative airflow discharged to the burn-in oven.