Feedthrough Capacitor Mounting Density ESL Reduction
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Solution Overview
Problem
The existing feedthrough capacitor mounted structures have low mounting density due to unused grid terminals and increased Electromagnetic Susceptibility (ESL) caused by unconnected grid terminals under the capacitors, which also lead to soldering issues and reduced substrate efficiency.
Innovation Solution
A feedthrough capacitor mounted structure with a substrate having isolated conductor portions and via holes arranged in a matrix pattern, where capacitors are positioned between adjacent via holes in an oblique direction, eliminating unused via holes and allowing closer via hole spacing to increase mounting density while maintaining low ESL by alternating current directions through via holes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If grid terminals are arranged in a matrix pattern with feedthrough capacitors mounted on them, then mounting density can be increased, but unused grid terminals under capacitors reduce substrate efficiency and increase ESL
Solution Approach 1:
The patent positions feedthrough capacitors in the spaces between via holes rather than directly on top of them, utilizing the interstitial spaces in the via hole matrix. This dimensional repositioning allows all via holes to remain connected and functional while accommodating capacitors, thereby increasing mounting density without sacrificing substrate efficiency or increasing ESL.
2Productivity
If via holes are placed closer together to increase mounting density, then more capacitors can be mounted per area, but ESL may increase due to closer spacing
Solution Approach 1:
The patent introduces an intermediary positioning strategy where capacitors are placed in the spaces between via holes rather than directly on them. This intermediary positioning allows via holes to be spaced closer together to increase density while maintaining adequate spacing between via holes to control ESL, as the capacitors no longer occupy the space directly over the via holes.
3Object-affected harmful factors
If grid terminals are arranged alternately to keep ESL low, then current directions are optimized, but mounting density decreases due to unused terminals
Solution Approach 1:
The patent makes all via holes functional by positioning capacitors between them rather than on them. Each via hole serves its original purpose of providing a current path, while simultaneously the spaces between them serve as mounting locations for capacitors. This multi-functional utilization eliminates unused via holes and increases mounting density while preserving the alternating arrangement that keeps ESL low.
Data Source
AI summary
A feedthrough capacitor having a pair of first terminal electrodes and a second terminal electrode is mounted on a mounting surface of a substrate. The substrate is an insulating substrate internally having first and second conductor portions isolated from each other, and has a plurality of first via holes, a plurality of second via holes, a plurality of first land electrodes, and a second land electrode. The first via holes and the second via holes, when viewed from the mounting surface side, are arranged in a matrix pattern and alternately arranged in a row direction and in a column direction. The feedthrough capacitor, when viewed from the mounting surface side, is located between a pair of said first via holes adjacent to each other in a direction intersecting with the row direction and also adjacent to each other in a direction intersecting with the column direction. The pair of first terminal electrodes are connected to the respective first land electrodes corresponding to the pair of adjacent first via holes. The second terminal electrode is connected to the second land electrode.