Feedthrough Contact Joint for Reliable Wire Attachment
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Solution Overview
Problem
Conventional feedthrough systems for electronic devices, especially in medical applications, face challenges in reliably attaching connecting wires to the end of electrically conductive pathways due to the difficulty in achieving a strong and durable connection, which can lead to device failure.
Innovation Solution
A feedthrough system with an electrically conductive pathway integrated into the insulating body, where an electrical contact element is attached to the level end of the pathway or an optional conductive pad using a joint microstructure, allowing for reliable wire attachment through methods like brazing or soldering, thereby preventing delamination and microfracturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a wire is directly attached to the end of the electrically conductive pathway in a conventional feedthrough, then the attachment process is simple, but the connection reliability is poor due to delamination and microfracturing
Solution Approach 1:
The patent introduces an electrical contact element as an intermediary component between the wire and the electrically conductive pathway. This contact element provides a dedicated attachment point that is mechanically stronger and more reliable than directly attaching the wire to the conductive pathway end, thereby resolving the contradiction between simple attachment process and reliable connection.
2Volume of moving object
If the end of the electrically conductive pathway is level with the insulator surface, then the device can be miniaturized, but wire attachment becomes difficult and unreliable
Solution Approach 1:
The electrical contact element serves as a mediator that allows the wire attachment to occur at an elevated position above the insulator surface, while the conductive pathway itself remains level with the surface for miniaturization. This resolves the contradiction by separating the miniaturization requirement from the wire attachment requirement.
3Reliability
If multiple conventional feedthroughs are used in a device, then the electrical connection requirements are met, but the device complexity increases and the number of potential failure modes increases
Solution Approach 1:
The patent combines the electrical conductor and the wire attachment function into a single integrated electrical contact element that is directly formed on the insulator surface. This merging of functions reduces the number of separate components needed while maintaining reliable electrical connections, thereby resolving the contradiction between connection capability and device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the robustness and reliability of the feedthrough system by providing a secure attachment point for wires, reducing the risk of connection failure and improving the durability of the device, especially in critical applications like implantable medical devices.
Implementation Method 1
The electrical contact element is attached to the level end of the electrically conductive pathway by a joint microstructure
Implementation Method 2
allowing for reliable wire attachment through methods like brazing or soldering
Data Source
AI summary
One aspect is a feedthrough system including a) a feedthrough including i) an insulating body, ii) an electrically conductive pathway, wherein an end of the electrically conductive pathway is level with a surface of the insulating body, iii) an electrically conductive pad, wherein the electrically conductive pad is attached to the level end of the electrically conductive pathway, b) an electrical contact element including a metal, wherein the electrical contact element is attached to the level end of the electrically conductive pathway by a joint microstructure, or wherein, when the feedthrough includes an electrically conductive pad, the electrical contact element is attached to the electrically conductive pad by a joint microstructure. Furthermore, the present embodiment refers to a process for preparing the inventive feedthrough system, and to a device including the inventive feedthrough system.