Chamber Feedthrough Cooling for Uniform Substrate Edge Heating
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Solution Overview
Problem
Conventional semiconductor fabrication methods face challenges in providing uniform temperature distribution over substrates during pre-epitaxial baking, especially at the substrate edges, which leads to non-uniform device quality and reduced throughput.
Innovation Solution
A heating system for substrate processing is introduced, featuring a continuous heating coil with heater rods and sockets, along with a cooling plate and inert gas passages to maintain uniform temperature distribution and reduce heat loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If batch multi-substrate processing is performed in a furnace, then throughput is improved, but temperature distribution uniformity deteriorates due to heat loss at substrate edges
Solution Approach 1:
The patent applies local quality by providing enhanced heating specifically at the substrate edges where heat loss occurs. Edge heating elements are positioned adjacent to the substrate edges to deliver localized thermal energy, compensating for the non-uniform heat distribution in batch processing furnaces and achieving uniform temperature across the entire substrate surface.
2Manufacturing precision
If single substrate processing is performed in an Epi chamber, then temperature distribution uniformity is improved, but throughput deteriorates due to one-substrate-at-a-time processing
Solution Approach 1:
The patent merges the advantages of both single-substrate and batch processing by combining multiple substrates in a batch configuration within the Epi chamber while maintaining uniform temperature distribution. The system integrates edge heating elements with the batch substrate holder, allowing multiple substrates to be processed simultaneously with uniform temperature control, thus achieving both high throughput and temperature uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves improved temperature uniformity across substrates, enhancing the quality and throughput of semiconductor devices by minimizing heat loss and maintaining consistent processing conditions.
Implementation Method 1
a first heater with a continuous heating coil
Implementation Method 2
A cooling plate is disposed around at least a portion of the feedthrough
Data Source
AI summary
A method and apparatus for providing uniform heating of substrates disposed within a processing chamber is provided. The apparatus includes one or more heating coils disposed in the processing chamber. The one or more heating coils are electrically coupled to a power source using heater rods. The heater rods are coupled to a socket on a distal end opposite the connection to the heating coils. The socket includes a feedthrough and a cooling plate configured to remove contaminants, such as methane, from the area surrounding the heater rod.