Feedthrough Element Thermal Loading via Crystallized Glass
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Solution Overview
Problem
Existing feedthrough or connecting elements face limitations in operating temperature ranges and pressure resistance, particularly in harsh environments exceeding 260°C, due to the degradation of insulating materials under high temperatures and mechanical stress.
Innovation Solution
A composite feedthrough element comprising a high-temperature alloy carrier body and an at least partially crystallized glass, where the glass is subjected to compressive stress, ensuring secure attachment and hermetic sealing up to extreme temperatures, with the glass potentially crystallizing further under thermal stress for enhanced stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional insulating materials (polymer or glass) are used in feedthrough elements, then electrical insulation is provided, but the operating temperature is limited to below 260°C due to material degradation under high temperature and pressure
Solution Approach 1:
The patent changes the physical-chemical state of the glass material by inducing crystallization to form a glass-ceramic composite structure. This parameter change transforms the amorphous glass into a crystalline structure that maintains dimensional stability and mechanical strength at temperatures up to 1200°C, resolving the temperature limitation of conventional insulating materials
Solution Approach 2:
The patent creates a composite material system consisting of a metal carrier body and crystallized glass (glass-ceramic). The metal carrier provides mechanical strength and thermal stability, while the crystallized glass provides electrical insulation and hermetic sealing. This composite structure enables the feedthrough element to withstand temperatures up to 1200°C and pressures over 42,000 psi
2Reliability
If the glass material is subjected to high temperature and pressure, then hermetic sealing is maintained, but the glass may detach from the carrier body due to thermal expansion mismatch
Solution Approach 1:
The patent utilizes differential thermal expansion between the metal carrier body and the glass material. The carrier body is designed with a larger thermal expansion coefficient than the glass, creating compressive stress on the glass during cooling after high-temperature processing. This compressive stress prevents glass detachment and maintains hermetic sealing under high temperature and pressure conditions
Solution Approach 2:
The patent applies compressive stress to the glass material during the manufacturing process (before service conditions) by controlling the cooling rate and temperature gradient. This preliminary application of compressive stress ensures that the glass remains firmly attached to the carrier body throughout the service life, preventing detachment under subsequent thermal and mechanical loads
3Ease of manufacture
If amorphous glass is used as insulating material, then manufacturing is simplified, but the operating temperature range is limited to 260-350°C
Solution Approach 1:
The patent applies thermal treatment (heat treatment) to transform the amorphous glass structure into a crystallized glass structure. By controlling the heating temperature and duration, the glass undergoes crystallization to form a glass-ceramic material that maintains electrical insulation properties while extending the operating temperature range to 1200°C. This parameter change resolves the contradiction between manufacturing simplicity and temperature capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables feedthrough elements to operate securely and hermetically at temperatures up to 1200°C and withstand pressures over 42,000 psi, suitable for applications in nuclear reactors, drilling, and spacecraft, with improved mechanical and thermal stability.
Implementation Method 1
the glass potentially crystallizing further under thermal stress for enhanced stability
Data Source
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AI summary
The invention relates to a lead-through or connecting element which has a composite carrier body (2), comprising a high-temperature alloy, and also has a functional element (4) and at least partially crystallized glass (3), wherein the at least partially crystallized glass (3) is arranged between a portion of the functional element (4) and a portion of the carrier body (2), and in the case of which the carrier body (2), comprising the high-temperature alloy, subjects the at least partially crystallized glass (3) to a compressive stress of greater than, or substantially equal to, zero, at a temperature of at least 20°C to more than 450°C, and also relates to a method for producing a lead-through or connecting element, and the use thereof, and to a measuring unit having such a lead-through or connecting element.