Female Connector Shielding Segmentation for Crosstalk Reduction
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Solution Overview
Problem
Conventional high-speed connectors have weak common ground performance and high crosstalk due to a single shielding sheet that does not contact the grounding terminals.
Innovation Solution
The female connector features transmission wafers with first and second shielding members electrically connected to grounding terminals, allowing adjacent wafers to establish a common ground by elastic abutment, thereby improving crosstalk performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single shielding sheet is used that does not contact the grounding terminals, then the device complexity is reduced, but the common ground performance deteriorates and crosstalk increases
Solution Approach 1:
The single shielding sheet is divided into multiple shielding members (first shielding member and second shielding member) that are separately disposed on opposite sides of the insulating frame. Each shielding member independently contacts the grounding terminals, providing segmented grounding paths that improve common ground performance while maintaining structural simplicity
Solution Approach 2:
The grounding terminals serve as intermediaries that electrically connect the first and second shielding members to the insulating frame and to each other through adjacent transmission wafers. This intermediary connection establishes a reliable common ground network without requiring direct shielding member-to-shielding member contact
2Ease of manufacture
If a single shielding sheet is used that does not contact the grounding terminals, then the manufacturing process is simplified, but the crosstalk performance deteriorates
Solution Approach 1:
The shielding structure is segmented into multiple independent shielding members that can be separately manufactured and assembled. Each shielding member is disposed on opposite sides of the insulating frame and contacts grounding terminals, creating effective electromagnetic shielding that reduces crosstalk while maintaining ease of assembly
Solution Approach 2:
The shielding approach transitions from a single-plane shielding sheet to a three-dimensional arrangement with shielding members on opposite sides of the insulating frame. This spatial distribution creates effective electromagnetic containment in multiple directions, reducing crosstalk without complicating the manufacturing process
3Reliability
If the second shielding member is abutted against the first shielding member of adjacent wafers, then the common ground performance is improved, but the device complexity increases
Solution Approach 1:
The transmission wafers are designed with self-aligning features where the first and second shielding members automatically abut against each other when adjacent wafers are stacked. This self-service mechanism establishes electrical connection between grounding terminals of adjacent wafers without requiring additional alignment fixtures or complex assembly procedures
Solution Approach 2:
The abutment between the second shielding member of one wafer and the first shielding member of the adjacent wafer creates an equipotential connection between grounding terminals. This electrical continuity establishes a unified common ground across multiple stacked wafers, improving reliability while maintaining simple stacking structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively enhances the common ground performance and reduces crosstalk in the female connector by establishing electrical connections between shielding and grounding terminals across adjacent wafers.
Implementation Method 1
the second shielding member of one of the two adjacent transmission wafers is elastically abutted against and electrically connected to the first shielding member of the other one of the two adjacent transmission wafers
Implementation Method 2
The first shielding member and the second shielding member are electrically connected to the grounding terminals so as to be electrically connected to each other through the grounding terminals
Data Source
AI summary
A female connector and a transmission wafer are provided. The female connector includes a housing and a plurality of transmission wafers inserted into the housing. Each of the transmission wafers includes an insulating frame, a plurality of grounding terminals fixed to the insulating frame, and a first shielding member and a second shielding member respectively disposed on two opposite sides of the insulating frame. In each of the transmission wafers, the second shielding member is disposed on a front end portion of the insulating frame, and the first and second shielding members are electrically connected to the grounding terminals so as to be electrically connected to each other through the grounding terminals. The second shielding member of one of any two adjacent transmission wafers is abutted against and electrically connected to the first shielding member of the other one of the any two adjacent transmission wafers.