Laminated FeRAM Ferroelectric Stack for Memory Window Gain

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Ferroelectric Random Access Memory (FeRAM) cells have a destructive read process that overwrites data, and existing technologies struggle to improve performance without increasing grain size in ferroelectric layers, which can lead to threshold thickness issues.

Innovation Solution

A laminated ferroelectric layer is formed using alternating layers of high-k dielectric materials with different crystallization temperatures, where a first amorphous layer is deposited followed by a polycrystalline layer, and then alternating layers are added to control grain size and increase thickness, enhancing the orthorhombic phase intensity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the ferroelectric layer thickness is increased to improve memory window, then the memory window is improved, but the grain size increases leading to threshold thickness issues

Engineering Contradiction:
Improvememory windowVSAvoidgrain size
Core Design Contradiction:
ReliabilityVSLength of moving object

Solution Approach 1:

The ferroelectric layer is segmented into multiple thin sub-layers (first ferroelectric layer, second ferroelectric layer, third ferroelectric layer) with different crystallization temperatures. This segmentation allows the total thickness to be increased for improved memory window while each individual sub-layer maintains controlled grain size through its specific crystallization temperature, preventing threshold thickness issues.

Inventive Principle:
Principle #1Segmentation

2Reliability

If alternating layers with different crystallization temperatures are used, then orthorhombic phase intensity is enhanced, but the device complexity increases

Engineering Contradiction:
Improveorthorhombic phase intensityVSAvoidlayer structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The invention changes the parameter of crystallization temperature across different ferroelectric layers, creating a gradient structure where each layer has a specific crystallization temperature (first layer: higher temperature, second layer: intermediate temperature, third layer: lower temperature). This parameter variation enhances orthorhombic phase intensity while the systematic approach to layer formation keeps the manufacturing process manageable.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach improves the performance of FeRAM cells by increasing the memory window and reducing defects, while limiting grain size to maintain optimal orthorhombic phase intensity, resulting in improved current switching and reduced defect rates.

Implementation Method 1

a first amorphous layer is deposited followed by a polycrystalline layer, and then alternating layers are added to control grain size and increase thickness, enhancing the orthorhombic phase intensity

Methodology Applied
Scientific EffectCrystallization: Crystallisation

Data Source

PatentUS11844226B2FeRAM with laminated ferroelectric film and method forming same
Publication Date: 2023.12.12 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US11844226B2 patent drawing
  • US11844226B2 patent drawing
  • US11844226B2 patent drawing

AI summary

A method includes forming a bottom electrode layer, and depositing a first ferroelectric layer over the bottom electrode layer. The first ferroelectric layer is amorphous. A second ferroelectric layer is deposited over the first ferroelectric layer, and the second ferroelectric layer has a polycrystalline structure. The method further includes depositing a third ferroelectric layer over the second ferroelectric layer, with the third ferroelectric layer being amorphous, depositing a top electrode layer over the third ferroelectric layer, and patterning the top electrode layer, the third ferroelectric layer, the second ferroelectric layer, the first ferroelectric layer, and the bottom electrode layer to form a Ferroelectric Random Access Memory cell.