Ferrite-Assisted Board Interconnects for Phase-Stable Semiconductor Layouts

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Solution Overview

Problem

As semiconductor devices increase in size to accommodate more functions, the shorter distances between circuit boards lead to shorter wire lengths, which disrupt phase characteristics, potentially deteriorating device performance.

Innovation Solution

Incorporating ferrites arranged directly below the wires connecting circuit boards in a semiconductor device, allowing for adjustment of phase characteristics without lengthening the electrical length of the wires, thereby maintaining performance while allowing for increased circuit board size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the size of circuit boards is increased to accommodate more functions, then the functionality of the semiconductor device is improved, but the distance between circuit boards becomes narrower and wire length becomes shorter, causing phase characteristics to deteriorate

Engineering Contradiction:
ImprovefunctionalityVSAvoidphase characteristics
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

Ferrite members are introduced as intermediary elements positioned near the wires connecting circuit boards. These ferrite members mediate the electromagnetic field interactions to adjust and maintain phase characteristics despite reduced wire lengths, thereby resolving the contradiction between increased functionality and maintained phase characteristics.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent utilizes ferrite members with specific magnetic properties to change the electromagnetic parameters (phase characteristics) of the wire connections. By introducing materials with different magnetic permeability, the phase characteristics can be adjusted without changing the physical wire length, thus maintaining reliability while allowing for increased circuit board functionality.

Inventive Principle:
Principle #35Parameter changes

2Volume of moving object

If wire length is shortened due to narrower spacing between circuit boards, then the device size is reduced, but phase characteristics cannot be maintained and performance deteriorates

Engineering Contradiction:
Improvedevice sizeVSAvoidphase characteristics
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

Ferrite members serve as intermediary components that compensate for the phase characteristic deterioration caused by shortened wires. These members are positioned in proximity to the wires to modify the electromagnetic field and maintain the required phase characteristics despite the reduced wire length, thus preserving reliability while enabling compact device design.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

By introducing ferrite members with specific magnetic properties, the electromagnetic parameters (phase velocity, wavelength) are changed to compensate for the shortened wire length. This allows the phase characteristics to be maintained or adjusted without increasing the physical wire length, thereby maintaining reliability in a compact device configuration.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The ferrite arrangement effectively maintains phase characteristics, enabling shorter wire lengths without performance degradation, allowing for larger circuit boards and increased functionality within the semiconductor device.

Implementation Method 1

a first ferrite arranged on the base and directly below the first wire between the first circuit board and the second circuit board

Methodology Applied
Scientific EffectMagnetic properties of ferrite: Magnetism

Data Source

PatentUS20240014150A1Semiconductor device and method for adjusting phase characteristics thereof
Publication Date: 2024.01.11 KK TOSHIBA
  • US20240014150A1 patent drawing
  • US20240014150A1 patent drawing
  • US20240014150A1 patent drawing

AI summary

According to one embodiment, a semiconductor device includes a base, a first circuit board provided on the base, a second circuit board provided on the base at a certain interval from the first circuit board, a first connector provided with a first wire that is bridged between an upper surface of the first circuit board and an upper surface of the second circuit board to connect the two boards, and a first ferrite arranged on the base and directly below the first wire between the first circuit board and the second circuit board.