Embedded Ferrite Disc Microstrip Circulator for Uniform Magnetization

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current microstrip circulators and isolators face issues with magnetization uniformity, leading to poor performance, especially at higher frequencies, due to the use of ferrite tiles that are difficult to magnetize uniformly, resulting in increased insertion loss and intermodulation distortion.

Innovation Solution

An integrated microstrip circulator is formed by embedding a ferrite disc, such as a yttrium iron garnet disc, into a dielectric substrate with an inorganic adhesive, allowing for improved magnetization and metallization without degrading the adhesive, and incorporating conductive vias for electrical connection, enabling efficient radiofrequency applications.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If ferrite tiles are used in microstrip circulators, then the device structure is simple, but magnetization uniformity is poor leading to increased insertion loss and intermodulation distortion

Engineering Contradiction:
Improvedevice structureVSAvoidmagnetization uniformity
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent changes the shape parameter of the ferrite component from a tile (flat rectangular) to a cylindrical form factor. This geometric parameter change enables uniform magnetization throughout the ferrite material, resolving the magnetization uniformity issue while maintaining structural simplicity. The cylindrical geometry allows for consistent magnetic field distribution during the magnetization process.

Inventive Principle:
Principle #35Parameter changes

2Ease of manufacture

If ferrite tiles are used, then manufacturing is easier, but performance at higher frequencies deteriorates due to poor magnetization

Engineering Contradiction:
Improvemanufacturing easeVSAvoidhigh-frequency performance
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The invention changes the geometric parameters of the ferrite component from a flat tile to a cylinder with specific height and diameter ratios. This parameter change improves high-frequency performance by enabling uniform magnetization, while the manufacturing process remains relatively simple through standard ceramic fabrication techniques and adhesive bonding.

Inventive Principle:
Principle #35Parameter changes

3Area of stationary object

If conventional ferrite assemblies are used, then device size is larger, but integration with surface mount technology is limited

Engineering Contradiction:
Improvedevice sizeVSAvoidsurface mount integration
Core Design Contradiction:
Area of stationary objectVSAdaptability or versatility

Solution Approach 1:

The patent transitions from a two-dimensional flat ferrite tile to a three-dimensional cylindrical ferrite component. This dimensional change enables the circulator to be mounted vertically on surface mount substrates, improving adaptability to surface mount technology while reducing the horizontal footprint area occupied by the device.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances magnetization and reduces performance issues, providing lower insertion loss and intermodulation distortion, while allowing for miniaturization and integration of components, particularly beneficial for 5G systems operating at frequencies above 1.8 GHz.

Implementation Method 1

a ferrite disc secured within the aperture in the dielectric substrate

Methodology Applied
Scientific EffectAdhesive bonding: Adhesive

Implementation Method 2

allowing for improved magnetization and metallization without degrading the adhesive

Methodology Applied
Scientific EffectMagnetization: Magnetism

Implementation Method 3

conductive vias for electrical connection, enabling efficient radiofrequency applications

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 4

permit a signal to pass in one direction while providing high isolation to reflected energy in the reverse direction

Methodology Applied
Scientific EffectElectromagnetic wave propagation: Electromagnetic Induction

Data Source

PatentUS12113264B2Fabrication of surface mount microstrip circulators using a ferrite and ceramic dielectric assembly substrate
Publication Date: 2024.10.08 SKYWORKS SOLUTIONS INC
  • US12113264B2 patent drawing
  • US12113264B2 patent drawing
  • US12113264B2 patent drawing

AI summary

A method of forming an integrated microstrip circulator includes translating a ferrite disc into an aperture in a dielectric substrate, securing the ferrite disc in the dielectric substrate with an adhesive to form a composite structure, and forming circuitry on an upper surface of the composite structure and forming surface mount contacts on a lower surface of the composite structure by metallizing the upper and lower surfaces of the composite structure.