Ferrite Substrate PCB Antenna for Implantable Sensors
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Solution Overview
Problem
Existing implantable sensor devices face challenges with miniaturization, reliability, manufacturing cost-effectiveness, and performance due to size constraints, particularly with the use of discrete wire-wound ferrite cores, which require complex alignment and result in void spaces and manufacturing variability, affecting power transfer efficiency and noise suppression.
Innovation Solution
A printed circuit board made substantially of ferrite material with a coil pattern extending around opposing surfaces, eliminating the need for wire-wound coils and allowing for standardized manufacturing techniques, improved power transfer, and noise suppression through ferrite substrate routing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If discrete wire-wound ferrite cores are used in implantable sensor devices, then power transfer efficiency can be achieved, but device size increases and manufacturing complexity increases due to alignment requirements
Solution Approach 1:
The patent combines the ferrite core and coil structure into a single integrated printed circuit board assembly. The ferrite material is deposited directly onto the PCB substrate, and the coil traces are printed directly on the same substrate, eliminating the need for separate wire-wound coils and discrete ferrite cores. This merging of components achieves power transfer efficiency while reducing overall device volume.
Solution Approach 2:
The printed circuit board serves multiple functions simultaneously: it provides the structural substrate, contains the coil traces for electromagnetic coupling, and incorporates the ferrite material for magnetic flux concentration. This multi-functionality eliminates the need for separate discrete components, reducing device size while maintaining power transfer efficiency.
2Use of energy by moving object
If discrete wire-wound ferrite cores are used, then power transfer efficiency can be achieved, but manufacturing reliability decreases due to alignment and attachment difficulties
Solution Approach 1:
The ferrite material and coil traces are integrated into a single PCB manufacturing process, eliminating the need for separate attachment and alignment steps. The ferrite is deposited directly on the PCB substrate, and coil traces are printed using standard PCB fabrication techniques, significantly improving manufacturing reliability.
Solution Approach 2:
The patent replaces mechanical wire-winding and ferrite attachment processes with printed circuit board fabrication processes. Instead of mechanically assembling discrete components, the electromagnetic structure is created through printed traces and deposited ferrite material, eliminating alignment issues and improving manufacturing consistency.
3Power
If wire-wound coils are used, then electromagnetic coupling can be achieved, but void spaces are created leading to bubble formation and device failure
Solution Approach 1:
The patent replaces the mechanical wire-wound coil structure with printed circuit board traces. This substitution eliminates the void spaces between wire windings that trap bubbles during encapsulation, while maintaining electromagnetic coupling capability through the printed trace geometry and ferrite material.
Solution Approach 2:
The printed circuit board provides a solid, continuous substrate that eliminates void spaces. The ferrite material is deposited as a thin film on the PCB, creating a solid structure without internal cavities where bubbles could form during the encapsulation process, thereby improving device reliability.
4Power
If discrete wire-wound coils with ferrite cores are used, then electromagnetic functionality can be achieved, but device complexity increases due to alignment requirements
Solution Approach 1:
The patent merges the ferrite core, coil structure, and PCB substrate into a single integrated component. The ferrite is deposited directly on the PCB, and coil traces are printed on the same substrate, eliminating the need for separate alignment of discrete ferrite cores and wire-wound coils.
Solution Approach 2:
The printed circuit board performs multiple functions: it provides the structural base, contains the electromagnetic coil traces, and supports the ferrite material. This multi-functionality eliminates the need for separate alignment procedures for different components, reducing device complexity while maintaining electromagnetic functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ferrite substrate solution enables miniaturization, increased power transfer efficiency, and reduced noise interference, enhancing the reliability and cost-effectiveness of implantable sensor devices while maintaining accurate analyte measurements.
Implementation Method 1
inductively coupled RF energy emitted by the processing circuit
Implementation Method 2
noise suppression through ferrite substrate routing
Data Source
AI summary
A printed circuit device used in conjunction with inductive power and data transmission applications is formed substantially of ferrite material, with an inductive coil conductor formed around the substrate to increase the electromagnetic properties of the coil for both power and data transmission functions, thereby eliminating the need for a discrete ferrite core wire-wound coil to be connected to the circuit device.