Ferrite Wafer Connector Assembly for PCB EMI Suppression

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Solution Overview

Problem

Conventional RF beads used for EMI suppression in power converter systems are costly, occupy excessive space on PCBs, and negatively affect system efficiency.

Innovation Solution

A connector assembly integrating conductive through-holes, a connector, and a magnetic wafer cup that aligns terminal pins with conductive through-holes, providing efficient EMI suppression by minimizing the need for RF beads on PCBs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If RF beads are used for EMI suppression, then electromagnetic interference is suppressed, but system efficiency deteriorates and cost increases

Engineering Contradiction:
ImproveEMI suppressionVSAvoidsystem efficiency
Core Design Contradiction:
Object-affected harmful factorsVSLoss of energy

Solution Approach 1:

The patent combines the connector and EMI suppression function into a single integrated component. The connector housing incorporates ferrite material directly into its structure, merging the mechanical connection function with the electromagnetic interference suppression function. This eliminates the need for separate RF beads and reduces energy loss while maintaining EMI suppression effectiveness.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The connector utilizes composite material construction, specifically incorporating ferrite material into the connector housing. This composite structure provides both mechanical connectivity and magnetic properties for EMI suppression, resolving the contradiction between EMI suppression and system efficiency by using materials that simultaneously provide both functions without the energy losses associated with traditional RF beads.

Inventive Principle:
Principle #40Composite materials

2Object-affected harmful factors

If RF beads are used for EMI suppression, then electromagnetic interference is suppressed, but PCB area occupied increases

Engineering Contradiction:
ImproveEMI suppressionVSAvoidPCB area
Core Design Contradiction:
Object-affected harmful factorsVSArea of stationary object

Solution Approach 1:

The EMI suppression function is merged into the connector itself, which is already mounted on the PCB. By incorporating ferrite material into the connector housing, the patent eliminates the need for additional space-consuming RF beads on the PCB while maintaining effective EMI suppression. The connector serves dual purposes: mechanical connection and electromagnetic interference filtering.

Inventive Principle:
Principle #5Merging (Combining)

3Object-affected harmful factors

If traditional EMI suppression components are used, then electromagnetic interference is suppressed, but manufacturing complexity increases

Engineering Contradiction:
ImproveEMI suppressionVSAvoidassembly complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent integrates the EMI suppression function directly into the connector housing, creating a single-component solution. This merger eliminates the need for separate RF beads and reduces assembly steps, as the EMI suppression capability is built-in rather than added as a separate component during manufacturing.

Inventive Principle:
Principle #5Merging (Combining)

4Object-affected harmful factors

If RF beads are used for EMI suppression, then electromagnetic interference is suppressed, but cost increases

Engineering Contradiction:
ImproveEMI suppressionVSAvoidcost
Core Design Contradiction:
Object-affected harmful factorsVSQuantity of substance

Solution Approach 1:

The connector is designed as an integrated component that combines mechanical connectivity with EMI suppression functionality. By incorporating ferrite material into the connector housing during manufacturing, the patent eliminates the need for separate, costly RF beads. This integration reduces the total component count and associated costs while maintaining effective EMI suppression.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The use of composite materials, specifically ferrite incorporated into the connector housing, provides cost-effective EMI suppression. This approach replaces expensive RF beads with a more economical integrated solution that achieves the same EMI suppression function through material composition rather than separate components.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively suppresses electromagnetic interference while reducing costs and space requirements, improving system efficiency and assembly line construction feasibility.

Implementation Method 1

The magnetic wafer is configured to suppress electromagnetic interference

Methodology Applied
Scientific EffectMagnetic losses: Magnetic Hysteresis

Data Source

PatentUS10186812B1Ferrite wafer and connector assembly for EMI noise suppression on a printed circuit board
Publication Date: 2019.01.22 UNIVERSAL LIGHTING TECHNOLOGIES INC
  • US10186812B1 patent drawing
  • US10186812B1 patent drawing
  • US10186812B1 patent drawing

AI summary

A connector assembly suppresses electromagnetic interference (EMI) generated by electronic circuitry on a printed circuit board (PCB). Certain embodiments of the connector assembly include common features such as conductive through-holes on the PCB, and a connector having terminal pins positionable through the conductive through-holes. The first embodiment includes a magnetic wafer positionable between the connector and the PCB. The second embodiment includes a plurality of stackable magnetic wafers positionable in a stack between the connector and the PCB. The third embodiment includes a magnetic cup wafer positionable between the connector and the PCB. The fourth embodiment, combines the cup wafer with the stackable magnetic wafers of the second and third embodiments. Each magnetic wafer includes wafer holes for the terminal pins to pass through. The magnetic wafers are configured to increase inductance and provide effective EMI noise suppression.