Ferroelectric Capacitor Negative Capacitance Subthreshold Swing

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Solution Overview

Problem

Current semiconductor technologies face challenges in reducing power density due to high subthreshold swing limitations in silicon-based MOSFETs, making it difficult to achieve low supply voltages necessary for further miniaturization and integration.

Innovation Solution

Incorporating a ferroelectric material layer in the semiconductor device's conductive connection groups to form a negative capacitance ferroelectric capacitor, which amplifies voltage and improves switching speed by reducing subthreshold swing below 60 mV/decade.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If silicon-based MOSFET is used for transistor operation, then the transistor can be manufactured with standard processes, but the subthreshold swing is limited to 60 mV/decade or more, making it difficult to achieve low supply voltage

Engineering Contradiction:
ImprovemanufacturabilityVSAvoidsubthreshold swing
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent changes the physical parameter of the gate dielectric layer by introducing a ferroelectric material layer, which fundamentally alters the capacitance characteristics from positive to negative. This parameter change enables subthreshold swing below 60 mV/decade while maintaining compatibility with standard semiconductor manufacturing processes

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs a composite gate dielectric structure comprising a ferroelectric material layer combined with other dielectric materials. This composite structure achieves both the desired negative capacitance effect for improved subthreshold swing and the necessary electrical properties for reliable transistor operation

Inventive Principle:
Principle #40Composite materials

2Area of moving object

If the transistor size is miniaturized to increase integration density, then the degree of integration increases, but the power density increases exponentially due to insufficient drive voltage reduction

Engineering Contradiction:
Improvetransistor sizeVSAvoidpower density
Core Design Contradiction:
Area of moving objectVSPower

Solution Approach 1:

By changing the gate dielectric to a ferroelectric material, the patent achieves voltage amplification through negative capacitance, enabling the transistor to operate at lower supply voltages. This parameter change directly addresses the power density issue by allowing continued miniaturization without the exponential power increase that would otherwise occur

Inventive Principle:
Principle #35Parameter changes

3Reliability

If a ferroelectric material layer is introduced to achieve negative capacitance and subthreshold swing below 60 mV/decade, then voltage amplification and switching speed are improved, but the device structure and manufacturing process become more complex

Engineering Contradiction:
Improveswitching speedVSAvoiddevice structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent segments the gate dielectric layer into multiple functional layers, with the ferroelectric material layer positioned specifically between the gate electrode and the channel. This segmentation allows the ferroelectric layer to provide negative capacitance while other layers maintain electrical stability and interface quality, achieving improved switching speed without excessive structural complexity

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The implementation of a ferroelectric capacitor with negative capacitance enhances voltage amplification and switching speed, enabling transistors to operate with subthreshold swing less than 60 mV/decade, thus addressing the power density and integration challenges.

Implementation Method 1

the ferroelectric material layer forms a ferroelectric capacitor having a negative capacitance in the first conductive connection group

Methodology Applied
Scientific EffectNegative capacitance:

Data Source

PatentUS11387345B2Semiconductor device
Publication Date: 2022.07.12 SAMSUNG ELECTRONICS CO LTD
  • US11387345B2 patent drawing
  • US11387345B2 patent drawing
  • US11387345B2 patent drawing

AI summary

A semiconductor device includes a substrate, a gate structure on the substrate and a first conductive connection group on the gate structure. The gate structure includes a gate spacer and a gate electrode. The first conductive connection group includes a ferroelectric material layer. At least a part of the ferroelectric material layer is disposed above an upper surface of the gate spacer. And the ferroelectric material layer forms a ferroelectric capacitor having a negative capacitance in the first conductive connection group.