Ferroelectric Film Sputtering for High-Concentration Doping

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Solution Overview

Problem

Conventional methods for producing ferroelectric films, such as the sol-gel technique, face limitations in achieving high-concentration doping of B-site donor ions without sintering assistants or acceptor ions, leading to reduced thickness and performance due to Pb defects and decreased ferroelectric performance.

Innovation Solution

A non-thermal equilibrium process, specifically sputtering, is used to form PZT-based ferroelectric films with a columnar-grain structure, allowing high-concentration doping of B-site donor ions up to 40 mol% without sintering assistants or acceptor ions, resulting in enhanced ferroelectric performance and increased thickness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If high-concentration doping of B-site donor ions is attempted using conventional sol-gel technique, then doping concentration increases, but Pb defects occur and ferroelectric performance decreases

Engineering Contradiction:
Improvedoping concentrationVSAvoidferroelectric performance
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent changes the fundamental parameter of the manufacturing process from thermal equilibrium (sol-gel) to non-thermal equilibrium (sputtering). This parameter change enables high-concentration doping of B-site donor ions up to 40 mol% without forming Pb defects, thereby maintaining superior ferroelectric performance while achieving the desired doping concentration

Inventive Principle:
Principle #35Parameter changes

2Quantity of substance

If sintering assistants or acceptor ions are added to enable high-concentration doping, then doping concentration increases, but device complexity and manufacturing complexity increase

Engineering Contradiction:
Improvedoping concentrationVSAvoidmanufacturing complexity
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the need for sintering assistants (Si, Ge, Sn) and acceptor ions from the manufacturing process. By using non-thermal equilibrium sputtering, high-concentration doping is achieved without adding these extra components, thereby reducing manufacturing complexity and device structure complexity while achieving the desired doping concentration

Inventive Principle:
Principle #2Taking out (Extraction)

3Ease of manufacture

If conventional thermal equilibrium process is used, then manufacturing process is simple, but doping concentration is limited and film thickness is reduced

Engineering Contradiction:
Improvemanufacturing process simplicityVSAvoiddoping concentration
Core Design Contradiction:
Ease of manufactureVSQuantity of substance

Solution Approach 1:

The patent changes the thermal state parameter from equilibrium to non-equilibrium, using sputtering deposition. This enables high-concentration doping of B-site donor ions up to 40 mol% and produces thicker films without the limitations of conventional thermal equilibrium processes, while maintaining manufacturing feasibility

Inventive Principle:
Principle #35Parameter changes

4Quantity of substance

If high-concentration doping is achieved by adding sintering assistants, then doping concentration increases, but film thickness is limited due to crack formation

Engineering Contradiction:
Improvedoping concentrationVSAvoidfilm thickness
Core Design Contradiction:
Quantity of substanceVSLength of stationary object

Solution Approach 1:

The patent changes the manufacturing process parameter from thermal equilibrium to non-thermal equilibrium sputtering. This enables simultaneous achievement of high doping concentration (up to 40 mol%) and increased film thickness without crack formation, as the non-equilibrium process avoids the sintering assistant addition that causes structural degradation

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The process enables the production of ferroelectric films with superior piezoelectric performance and increased thickness, overcoming the limitations of conventional techniques by avoiding Pb defects and maintaining high ferroelectric performance.

Implementation Method 1

a non-thermal equilibrium process, specifically sputtering, is used to form PZT-based ferroelectric films

Methodology Applied
Scientific EffectSputtering: Sputtering

Data Source

PatentEP1973177B8Ferroelectric film, process for producing the same, ferroelectric device, and liquid discharge device
Publication Date: 2015.01.21 FUJIFILM CORP

AI summary

A ferroelectric film (40) having a columnar structure constituted by a plurality of columnar grains, and containing as a main component a perovskite oxide which has a composition expressed by a compositional formula A1+δ[(ZrxTi1-x)1-yMy]Oz, where A represents one or more A-site elements including lead (Pb) as a main component, M represents one or more of vanadium (V), niobium (Nb), tantalum (Ta), and antimony (Sb) as one or more B-site elements, zirconium (Zr) and titanium (Ti) are also B-site elements, 0 < x ≤ 0.7, 0.1 ≤ y ≤ 0.4, δ is approximately zero, z is approximately 3, and δ and z may deviate from 0 and 3, respectively, within ranges of δ and z in which the composition expressed by the compositional formula A1+δ[(ZrxTi1-x)1-yMy]Oz can substantially form a perovskite structure.