Ferroelectric Gate Dielectric Transistor Nonvolatile Memory

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Solution Overview

Problem

Current memory devices, such as DRAM, are highly volatile and require frequent refresh, losing data upon power loss, and lack scalability for high integration levels.

Innovation Solution

Incorporating a transistor with a gate dielectric comprising both ferroelectric and non-ferroelectric materials, which enables two stable memory states by polarizing the ferroelectric material, reducing short channel effects and enhancing scalability through a nonvolatile memory cell design.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If conventional DRAM memory cells are used, then rapid read/write speed is achieved, but high volatility requires frequent refresh and data loss occurs on power loss

Engineering Contradiction:
Improveread/write speedVSAvoiddata retention
Core Design Contradiction:
SpeedVSReliability

Solution Approach 1:

The gate dielectric is constructed as a composite structure combining ferroelectric material (for nonvolatile data retention) and non-ferroelectric material (for rapid read/write performance and interface quality). This composite approach allows the memory cell to achieve both fast operation and nonvolatile storage, resolving the contradiction between speed and reliability.

Inventive Principle:
Principle #40Composite materials

2Ease of manufacture

If conventional memory cell designs are used, then manufacturing is straightforward, but scalability for high integration levels is limited

Engineering Contradiction:
Improvefabrication simplicityVSAvoidintegration density
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The gate dielectric structure is configured with different material compositions in different regions (first region with ferroelectric material, second region with non-ferroelectric material), creating a laterally differentiated structure. This dimensional variation enables improved scalability and integration density while maintaining compatibility with existing manufacturing processes.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If ferroelectric material is used in the gate dielectric, then nonvolatile storage is achieved, but short channel effects increase

Engineering Contradiction:
Improvedata retentionVSAvoidshort channel effects
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The gate dielectric is designed with spatially varying material properties: ferroelectric material is placed in the first region where it provides nonvolatile storage, while non-ferroelectric material is placed in the second region where it suppresses short channel effects. This local differentiation allows each material to perform its optimal function without compromising the other, resolving the contradiction between data retention and short channel effect suppression.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a nonvolatile memory cell that retains data without power and improves scalability, enabling higher integration levels and stable data storage.

Implementation Method 1

Incorporating a transistor with a gate dielectric comprising both ferroelectric and non-ferroelectric materials, which enables two stable memory states by polarizing the ferroelectric material

Methodology Applied
Scientific EffectFerroelectric polarization:

Data Source

PatentUS11594611B2Transistors, memory cells and semiconductor constructions
Publication Date: 2023.02.28 MICRON TECHNOLOGY INC
  • US11594611B2 patent drawing
  • US11594611B2 patent drawing
  • US11594611B2 patent drawing

AI summary

Some embodiments include a semiconductor construction having a gate extending into a semiconductor base. Conductively-doped source and drain regions are within the base adjacent the gate. A gate dielectric has a first segment between the source region and the gate, a second segment between the drain region and the gate, and a third segment between the first and second segments. At least a portion of the gate dielectric comprises ferroelectric material. In some embodiments the ferroelectric material is within each of the first, second and third segments. In some embodiments, the ferroelectric material is within the first segment or the third segment. In some embodiments, a transistor has a gate, a source region and a drain region; and has a channel region between the source and drain regions. The transistor has a gate dielectric which contains ferroelectric material between the source region and the gate.