Ferroelectric Memory Cell Stack With Antiferroelectric Hysteresis Tuning

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Solution Overview

Problem

Conventional ferroelectric memory cells face challenges in controlling the hysteresis shape and properties, requiring high coercive electric fields that can lead to material breakdown, limiting the reliability and effectiveness of ferroelectric memory devices.

Innovation Solution

Incorporating antiferroelectric layers over ferroelectric layers in memory cells, allowing for customization of the hysteresis loop shape and coercive electric field strength, thereby reducing the required voltage and enhancing reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If high coercive electric field is applied to control ferroelectric hysteresis, then polarization switching is achieved, but material breakdown occurs reducing reliability

Engineering Contradiction:
Improvememory cell reliabilityVSAvoidmaterial breakdown
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent employs a composite capacitor structure consisting of a ferroelectric layer combined with an antiferroelectric layer. This composite material approach allows the system to achieve stable polarization states at lower electric fields, avoiding the material breakdown that occurs with high coercive fields in conventional ferroelectric-only structures. The antiferroelectric layer provides additional stability and enables hysteresis control without requiring excessively high voltages.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent modifies the electrical parameters of the memory cell by introducing the antiferroelectric layer, which changes the hysteresis loop characteristics. This parameter change enables polarization switching at lower electric field strengths, directly addressing the reliability issue caused by high field-induced material breakdown while maintaining effective polarization control.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If conventional dielectric materials are used in capacitor structures, then linear polarization is achieved, but non-volatile memory functionality is lost

Engineering Contradiction:
Improvememory retentionVSAvoidpolarization linearity
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent replaces conventional linear dielectric materials with a composite structure of ferroelectric and antiferroelectric layers. This composite material provides non-linear polarization characteristics essential for non-volatile memory functionality, while the antiferroelectric component adds stability to prevent spontaneous polarization loss, achieving both memory retention and controlled non-linearity.

Inventive Principle:
Principle #40Composite materials

3Manufacturing precision

If ferroelectric material deposition is controlled to tune hysteresis, then hysteresis shape is optimized, but manufacturing complexity increases with limited effectiveness

Engineering Contradiction:
Improvehysteresis tuning precisionVSAvoiddeposition process complexity
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent introduces an antiferroelectric layer in combination with the ferroelectric layer, creating a composite capacitor structure that provides inherent hysteresis control. This approach simplifies manufacturing by reducing the need for precise deposition parameter optimization, as the composite structure naturally provides stable and tunable hysteresis characteristics through material selection rather than process optimization.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The use of antiferroelectric layers in memory cells lowers the coercive electric field strength, improves reliability, and allows for lower voltage operation, addressing the reliability issues and material breakdown concerns in conventional ferroelectric memory cells.

Implementation Method 1

ferroelectric materials exhibit electric permittivity that is not constant as a function of the applied electric field. In addition, ferroelectric materials exhibit a non-zero polarization, also known as the remnant polarization, even with no electric field applied thereto

Methodology Applied
Scientific EffectFerroelectricity:

Implementation Method 2

Incorporating antiferroelectric layers over ferroelectric layers in memory cells, allowing for customization of the hysteresis loop shape and coercive electric field strength

Methodology Applied
Scientific EffectAntiferroelectricity:

Implementation Method 3

the relationship creates a polarization-electric field (PE) hysteresis loop

Methodology Applied
Scientific EffectHysteresis: Hysteresis

Data Source

PatentUS11889701B2Memory cell including polarization retention member(s) including antiferroelectric layer over ferroelectric layer
Publication Date: 2024.01.30 GLOBALFOUNDRIES DRESDEN MODULE ONE LLC & CO KG
  • US11889701B2 patent drawing
  • US11889701B2 patent drawing
  • US11889701B2 patent drawing

AI summary

Memory cells include various versions of a capacitor structure including a polarization retention member. Each polarization retention member includes an antiferroelectric layer over a ferroelectric layer. The antiferroelectric layer, among other layers, can be tailored to customize the hysteresis loop shape, and the coercive electric field required to change polarization of the memory cell. Metal electrodes, and/or dielectric or metallic interlayers may also be employed to tailor the hysteresis. The memory cells can include FeRAMs or FeFETs. The memory cells provide a lower coercive electric field requirement compared to conventional ferroelectric memory cells, enhanced reliability, and require minimum changes to integrate into current integrated circuit fabrication processes.