Multi-Layer Ferroelectric Waveguide Fiber Coupling

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Solution Overview

Problem

Current lithium niobate electro-optical modulators face challenges with microwave and optical waveguide crossings, leading to increased half-wave voltage and modulation length, and inefficient coupling to standard optical fibers, which limits their performance in high-frequency applications and packaging.

Innovation Solution

A fiber-to-fiber system for multi-layer ferroelectric on insulator waveguide devices is developed, featuring a fiber-to-chip coupler that couples light from standard optical fibers to multi-layer ferroelectric on insulator waveguides integrated with electrodes, enabling microwave and optical waveguide crossings compatible with packaging, and a second coupler for efficient output to standard optical fibers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If microwave and optical waveguide crossings are implemented in traditional lithium niobate modulators, then packaging compatibility is improved, but the half-wave voltage and modulation length increase

Engineering Contradiction:
Improvepackaging compatibilityVSAvoidhalf-wave voltage
Core Design Contradiction:
Adaptability or versatilityVSPower

Solution Approach 1:

The patent transitions from planar waveguide crossings to three-dimensional vertical crossings by stacking multiple lithium niobate layers. The microwave and optical waveguides are positioned in different vertical layers, allowing them to cross without interfering with each other's electromagnetic fields. This vertical separation in the third dimension enables packaging compatibility while maintaining low half-wave voltage and short modulation length.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The modulator is divided into multiple thin lithium niobate layers (e.g., two 200 nm layers) separated by a buffer layer. Each layer can be independently optimized for specific functions: one layer for optical waveguiding and another for microwave electrodes. This segmentation allows the electromagnetic fields to be confined to specific layers, reducing cross-interference and maintaining efficient electro-optical modulation while enabling waveguide crossings.

Inventive Principle:
Principle #1Segmentation

2Adaptability or versatility

If standard optical fiber coupling is used, then system integration is improved, but coupling efficiency is reduced compared to specialty lensed fibers

Engineering Contradiction:
Improvesystem integrationVSAvoidcoupling loss
Core Design Contradiction:
Adaptability or versatilityVSLoss of energy

Solution Approach 1:

The patent modifies the optical waveguide parameters (dimensions, refractive index profile, mode field distribution) to better match the mode field of standard single-mode fibers. By adjusting the waveguide geometry and material composition, the evanescent field extends further into the buffer layer, creating a mode profile that couples more efficiently to standard fiber while maintaining the advantages of integrated waveguide crossings.

Inventive Principle:
Principle #35Parameter changes

3Speed

If thin film lithium niobate on insulator is used, then electro-optical bandwidth is improved to 100 GHz, but waveguide crossing capability is lost

Engineering Contradiction:
Improveelectro-optical bandwidthVSAvoidwaveguide crossing capability
Core Design Contradiction:
SpeedVSAdaptability or versatility

Solution Approach 1:

The thin film lithium niobate is segmented into multiple discrete layers (e.g., two separate 200 nm layers) rather than using a single thick film. This segmentation allows independent optimization of each layer's thickness and position, enabling the buffer layer to be positioned exactly where needed to facilitate waveguide crossings while maintaining the thin-film benefits of high bandwidth and low capacitance.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent utilizes the vertical dimension by stacking thin film layers to create three-dimensional waveguide crossings. The buffer layer is positioned vertically between the optical and microwave waveguides, allowing them to cross in the horizontal plane without electrical interference. This vertical stacking approach preserves the thin-film advantages while adding waveguide crossing capability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution allows for efficient packaging and operation of electro-optical modulators at frequencies over 100 GHz with reduced coupling loss, enabling their use in ultra-wideband high-dynamic range receivers and hybrid quantum networks.

Implementation Method 1

a fiber-to-chip coupler that couples light from a standard optical fiber to multi-layer ferroelectric on insulator waveguides

Methodology Applied
Scientific EffectOptical coupling: Optical Fibre

Implementation Method 2

multi-layer ferroelectric on insulator waveguides are integrated with electrodes to implement an optical device, an electro-optical device, or a non-linear optical device

Methodology Applied
Scientific EffectWaveguide propagation: Waveguide (optics)

Data Source

PatentUS12019271B2Fiber-to-fiber platform for multi-layer ferroelectric on insulator waveguide devices
Publication Date: 2024.06.25 OHIO STATE INNOVATION FOUND
  • US12019271B2 patent drawing
  • US12019271B2 patent drawing
  • US12019271B2 patent drawing

AI summary

A fiber-to-fiber system for multi-layer ferroelectric on insulator waveguide devices is described. The system comprises a fiber-to-chip coupler that couples light from a standard optical fiber to multi-layer ferroelectric on insulator waveguides. The multi-layer ferroelectric on insulator waveguides are integrated with electrodes to implement an optical device, an electro-optical device, or a non-linear optical device, such as an electro-optical modulator, with microwave and optical waveguide crossings compatible with packaging. A second fiber-to-chip coupler outputs the light from the multi-layer ferroelectric on insulator device to a standard optical fiber.