Ferromagnetic Conductive Bump Alignment via Electromagnetic Orientation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The complexity of manufacturing semiconductor packages with miniaturized components leads to alignment issues and poor reliability in electrical connections due to the opaque molding compound covering alignment marks, resulting in misalignment and increased yield loss.
Innovation Solution
Incorporating an elongated ferromagnetic member within conductive bumps that are electromagnetically attracted and oriented by a conductive trace's electromagnetic field, ensuring accurate placement and alignment on the substrate or wafer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an opaque molding compound is used to package semiconductor components, then the semiconductor package is protected and structurally intact, but alignment marks become invisible and alignment precision deteriorates
Solution Approach 1:
The patent applies preliminary action by exposing the ferromagnetic member end before the molding compound is applied. The conductive bump with exposed ferromagnetic member is placed on the substrate first, allowing alignment to be performed while the alignment mark is still accessible. Only after alignment is complete is the molding compound applied to provide structural protection, thus resolving the contradiction between early structural protection and later alignment precision.
2Volume of moving object
If miniaturized semiconductor components are used to increase density, then the semiconductor package size is reduced, but manufacturing complexity increases and alignment precision deteriorates
Solution Approach 1:
The patent introduces an intermediary mechanism - the exposed ferromagnetic member - that mediates between the miniaturized conductive bump and the substrate for alignment purposes. This intermediary provides a distinct magnetic signature that can be detected by alignment equipment, enabling precise alignment of miniaturized components without requiring larger physical alignment features, thus resolving the contradiction between miniaturization and alignment precision.
3Ease of manufacture
If conductive bumps are placed without electromagnetic orientation, then the manufacturing process is simple, but placement precision and orientation accuracy deteriorate
Solution Approach 1:
The patent applies self-service by enabling the conductive bump to self-align and self-orient through electromagnetic interaction. The exposed ferromagnetic member automatically responds to the electromagnetic field generated by the conductive trace, causing the conductive bump to self-position and self-orient correctly on the substrate. This eliminates the need for complex external alignment equipment while achieving high placement precision, resolving the contradiction between manufacturing simplicity and placement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the reliability of electrical connections by ensuring precise alignment and placement of conductive bumps, reducing yield loss and improving the overall reliability of semiconductor packages.
Implementation Method 1
an elongated ferromagnetic member within a conductive bump to facilitate an alignment of the conductive bump on a predetermined position of a substrate or wafer and an orientation of the conductive bump on the predetermined position. The elongated ferromagnetic member is under an electromagnetic field generated by a conductive trace
Implementation Method 2
The elongated ferromagnetic member is under an electromagnetic field generated by a conductive trace and is electromagnetically attracted to dispose the conductive bump at a predetermined position and at a predetermined orientation
Data Source
AI summary
A semiconductor structure includes a conductive bump, and a ferromagnetic member extended within the conductive bump, wherein a center of the conductive bump is disposed on a central axis of the ferromagnetic member.