Ferromagnetic Core Layer for Semiconductor Package Warpage Control
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Solution Overview
Problem
Fan-out semiconductor packages face challenges in manufacturing due to warpage caused by differences in thermal expansion coefficients of materials, making it difficult to transfer panels and maintain process accuracy during large-scale production.
Innovation Solution
Incorporating a core layer made of ferromagnetic material in the semiconductor package frame, which allows physical fixation to a magnetic plate, thereby maintaining flatness and preventing warpage during manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a fan-out semiconductor package is manufactured at a panel level with large size, then productivity is improved, but warpage occurs due to difference in coefficients of thermal expansion making it difficult to transfer the panel
Solution Approach 1:
The patent changes the magnetic property parameter of the core layer by using ferromagnetic material, which enables magnetic attraction to the magnetic plate. This parameter change allows the panel to be stably fixed during manufacturing processes, preventing warpage while maintaining large-size panel manufacturing for high productivity
Solution Approach 2:
The patent introduces a magnetic plate as an intermediary element that interacts with the ferromagnetic core layer. This intermediary provides a stable base for panel fixation, enabling accurate transfer and processing of large-size panels without warpage issues
2Adaptability or versatility
If materials with different coefficients of thermal expansion are used for semiconductor chip, redistribution layer, and other components, then functionality and versatility are improved, but warpage occurs making it difficult to maintain process accuracy
Solution Approach 1:
The patent changes the magnetic property parameter of the core layer to ferromagnetic, enabling magnetic fixation to the magnetic plate. This fixation method compensates for warpage caused by thermal expansion differences, maintaining process accuracy while allowing use of diverse materials for enhanced functionality
Solution Approach 2:
The patent applies preliminary anti-action by using magnetic attraction force to counteract the warpage tendency caused by thermal expansion differences. The magnetic plate and ferromagnetic core layer create a restraining force that prevents deformation during manufacturing processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables easier and more accurate manufacturing of semiconductor packages by preventing warpage and allowing for precise stacking and redistribution of connection pads, enhancing the package's rigidity and uniformity.
Implementation Method 1
a core layer formed of a ferromagnetic material
Data Source
AI summary
A semiconductor package includes a core layer formed of a ferromagnetic material, and includes a frame passing through the core layer and having a through-hole, a semiconductor chip disposed in the through-hole of the frame, and having an active surface on which a connection pad is disposed, and an inactive surface opposite to the active surface, an encapsulant covering at least a portion of the semiconductor chip, and a first connection structure including a first redistribution layer disposed on the active surface of the semiconductor chip and electrically connected to the connection pad.