Ferromagnetic Sputtering Target Flat Phases Particle Reduction
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Solution Overview
Problem
Magnetron sputtering targets with ferromagnetic materials face challenges in achieving stable electrical discharge with low particle generation and high pass-through flux due to uneven target structures and differences in erosion speeds between coarse and matrix phases.
Innovation Solution
A ferromagnetic sputtering target with a composition of 20 mol % or less Cr and Co, or 5-30 mol % Pt and Co, featuring flat phases with an average grain size of 10-150 μm and an aspect ratio of 1:2 to 1:10, separated by a basis metal, and optionally including additive elements and inorganic materials, to enhance sputtering performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If spherical phases are used in the target structure to improve pass-through flux, then the pass-through flux increases, but particle generation during sputtering increases
Solution Approach 1:
The patent applies the opposite approach by using flat plate-like phases instead of spherical phases. The flat phases have an aspect ratio of 1:2 to 1:10 and average grain size of 10 μm to 150 μm, which prevents the flaking-off problem associated with spherical phases while maintaining good pass-through flux characteristics.
Solution Approach 2:
The patent creates local quality differences by forming flat phases containing 90 wt% or more of Co within the basis metal, with the phases having specific morphology (flat plate-like structure). This local structural optimization reduces particle generation at phase boundaries while maintaining overall target performance.
2Reliability
If coarse metal grains are used to increase pass-through flux, then the pass-through flux improves, but the sinterability decreases and coarse phases form that flake off during sputtering
Solution Approach 1:
The patent changes the morphological parameters of the phases from spherical to flat plate-like structures with controlled aspect ratios (1:2 to 1:10) and specific grain sizes (10-150 μm). This parameter optimization allows the phases to maintain good sinterability while achieving adequate pass-through flux, preventing the flaking-off issue.
3Object-generated harmful factors
If there are large differences in erosion speed between coarse phase and matrix, then particle generation increases, but this is unavoidable with conventional target structures
Solution Approach 1:
The patent promotes compositional and structural homogeneity by ensuring flat phases contain 90 wt% or more of Co, making them compositionally similar to the Co-based basis metal. This compositional homogeneity reduces erosion speed differences between phases and matrix, minimizing particle generation during sputtering.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The target structure ensures efficient ionization and reduced particle generation, leading to stable electrical discharge, prolonged target life, and cost-effective production of high-quality magnetic thin films with improved pass-through flux.
Implementation Method 1
a magnetron sputtering device comprising a DC power source
Implementation Method 2
since much of the magnetic flux from the magnet will pass through the target
Implementation Method 3
A sputtering target of ferromagnetic material comprising metal having a composition containing 20 mol % or less of Cr, and Co as the remainder
Data Source
AI summary
A ferromagnetic sputtering target comprising metal having a composition containing 20 mol % or less of Cr, and Co as the remainder; wherein the target structure includes a basis metal (A), and flat phases (B), containing 90 wt % or more of Co, within the basis metal (A), the average grain size of the phases (B) is 10 μm or more and 150 μm or less, and the average aspect ratio of the phases (B) is 1:2 to 1:10. Provided is a ferromagnetic sputtering target capable of inhibiting the generation of particles during sputtering, and improving the pass-through flux to achieve a stable electrical discharge with a magnetron sputtering device.