Flexible Flat Cable Window Soldering for Precise FCC Assembly
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Solution Overview
Problem
Current soldering methods for flexible printed circuits in new energy battery packs face issues such as cold solder joint quality, high production costs, and environmental pollution due to etching processes, which are not suitable for flexible flat cable connect flexible die-cut circuit (FCC) production.
Innovation Solution
A method and system involving window creation, precise solder paste application, inspection, double-sided tape attachment, and laser soldering with visual and temperature monitoring to produce flexible printed circuits with high precision and low cost, using laser-specific solder paste and a modular system for precise assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If reflow soldering is used for FCC-type product soldering manufacturing, then whole-board soldering can be achieved, but product protection costs and fixture costs increase
Solution Approach 1:
The patent divides the soldering process into two distinct stages: first, pre-soldering the FDC to the FFC at specific connection points; second, assembling the FFC-FDC connection structure into the battery pack and performing reflow soldering. This segmentation allows selective soldering of critical connections without requiring protection of entire products or complex fixtures, thereby reducing costs while maintaining soldering quality.
2Ease of manufacture
If high-current pulse soldering is used for FCC-type product soldering manufacturing, then local single-point soldering is achieved, but soldering time increases and FFC insulation may be burned
Solution Approach 1:
The patent employs periodic action by using reflow soldering in two sequential stages rather than continuous high-current pulse soldering. The first stage pre-solders critical points, and the second stage completes the soldering after assembly. This periodic approach distributes thermal energy over time, preventing insulation burning while maintaining productivity.
3Ease of manufacture
If high-current pulse soldering is used for FCC-type product soldering manufacturing, then local single-point soldering is achieved, but quality risks increase due to potential insulation burning
Solution Approach 1:
The patent applies preliminary action by pre-soldering the FDC to the FFC at specific connection points before final assembly. This preliminary soldering ensures critical electrical connections are established with controlled thermal input, reducing the risk of insulation burning during subsequent assembly and reflow processes, thereby improving overall quality reliability.
4Adaptability or versatility
If traditional FPC with etching processes is used, then electrical signal collection functionality is achieved, but environmental pollution occurs
Solution Approach 1:
The patent fundamentally changes the manufacturing parameters of the flexible circuit by replacing the traditional etching process with a lamination process. Instead of chemically etching copper traces onto a flexible substrate, the invention laminates conductive copper foil onto a flexible insulating substrate and selectively removes the insulating material at connection points. This parameter change eliminates harmful chemical etching processes while maintaining the electrical signal collection functionality.
5Ease of manufacture
If local single-point soldering is used, then FCC-type product soldering is achieved, but labor costs increase
Solution Approach 1:
The patent merges the soldering operations by performing reflow soldering on the entire FFC-FDC assembly after it is integrated into the battery pack structure. This combining of soldering operations allows simultaneous soldering of multiple connection points in one process step, reducing the need for repeated manual positioning and soldering operations, thereby decreasing labor costs while maintaining FCC-type product soldering capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures high processing precision, guaranteed product quality, low production costs, and environmental friendliness by eliminating pollution, while achieving efficient and reliable soldering of flexible printed circuits.
Implementation Method 1
S600: Soldering the branch circuit boards to the flexible flat cable at window positions to produce flexible printed circuits
Implementation Method 2
laser soldering
Implementation Method 3
S400: Attaching double-sided tape near the solder paste; S500: Adhering and assembling branch circuit boards at double-sided tape positions
Data Source
AI summary
Method and System for Soldering Flexible Printed Circuit, wherein the soldering method comprises: S100: creating windows in flexible flat cable; S200: applying solder paste at window positions; S300: performing solder paste inspection; S400: attaching double-sided tape near the solder paste; S500: adhering and assembling branch circuit boards at double-sided tape positions; S600: soldering branch circuit boards to flexible flat cable at window positions. This method involves no pollution during production, achieves high processing precision, and maintains low production costs.