FFF Infill Structure with Interlocking T-Shaped Traces
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Solution Overview
Problem
Fused Filament Fabrication (FFF) methods face challenges in achieving sufficient strength in the Z-direction of 3D printed objects due to the layer deposition process, requiring additional processing steps and energy consumption for post-processing techniques like heat treatment or radiation to enhance layer bonding.
Innovation Solution
A method for creating instructions for FFF printers that involves printing layers with parallel traces and strategically placed voids, where each layer is offset to fill voids in the previous layer, creating a repetitive T-shaped structure that increases Z-strength without additional processing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If additional heat treatment or radiation curing steps are applied to increase Z-strength, then layer bonding strength is improved, but processing time and energy consumption increase
Solution Approach 1:
The patent applies preliminary action by designing the infill structure with intentionally created voids in each layer that are pre-positioned to be filled by the next layer. This preliminary structuring of voids and traces ensures that when material is deposited, it automatically fills the voids and creates interlocking T-shaped connections between layers, achieving strong Z-direction bonding without requiring subsequent heat treatment or radiation curing steps.
2Strength
If additional heat treatment or radiation curing steps are applied to increase Z-strength, then layer bonding strength is improved, but energy consumption increases
Solution Approach 1:
The patent applies self-service by designing an infill structure where the traces and voids are configured to automatically interlock during the printing process itself. The material deposited in one layer fills the voids created in the previous layer, creating T-shaped connections that provide Z-strength inherently through the geometry of the printed structure, eliminating the need for external energy-intensive post-processing treatments.
3Ease of manufacture
If standard infill structure with continuous traces is used, then printing process is simple, but Z-strength is insufficient
Solution Approach 1:
The patent applies segmentation by dividing the infill structure into discrete traces separated by voids in each layer, rather than using continuous infill. This segmentation creates intentional gaps that are filled by the next layer, forming interlocking T-shaped connections. The segmented approach maintains printing simplicity while achieving superior Z-strength through the interlayer void-filling mechanism.
Solution Approach 2:
The patent applies local quality by creating voids at specific locations between traces in each layer, while maintaining traces at other locations. This localized variation in structure (trace vs. void) enables the next layer to fill the voids and create interlocking connections, providing enhanced Z-strength at the interface between layers while keeping the overall printing process simple.
Data Source
AI summary
A method of creating instructions for an FFF printer for printing an infill structure of a 3D object is described. Instructions are created for printing a first layer (1) comprising a number of substantially parallel traces (11) that are separated by intermediate elongated first voids (12) with a first predefined width, and for printing a second layer (2) with traces (21) running substantially in parallel to the traces of the first layer, but with a first offset to the traces of the first layer, such that the traces of the second layer are arranged above the elongated first voids in the first layer, and for printing a third layer (3) with traces (31) running substantially in parallel to the traces of the second layer, but with a second offset to the traces of the second layer, wherein the traces in the third layer are separated by intermediate elongated third voids.