Functionally Graded Material Design for High Temperature Environments

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional thin film design methods for high-temperature environments are inefficient and costly, relying heavily on empirical knowledge and prone to delamination due to thermal expansion coefficient differences between the substrate and coating layers, and the process of developing functionally graded materials is time-consuming and expensive.

Innovation Solution

A multi-scale simulation-based method for designing functionally graded materials, which includes inputting information about base and coating layers, determining the structure and physical properties of the functionally graded material composition through structural optimization and density functional theory, and analyzing thermal stress using finite element analysis to output optimal composition and thickness configurations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional empirical methods are used for thin film design, then the design process is simple to implement, but the efficiency is very low and time-consuming

Engineering Contradiction:
Improvethin film design efficiencyVSAvoidtime for forming and checking thin films
Core Design Contradiction:
ProductivityVSLoss of time

Solution Approach 1:

The patent applies preliminary action by performing computational design and multi-scale simulation before actual thin film fabrication. The system calculates physical property values, optimizes functionally graded material compositions, and predicts thermal stress behavior in advance, allowing researchers to select optimal designs before experimental validation, thereby dramatically reducing the number of trial-and-error cycles needed

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent creates virtual models and simulations of thin film structures that replicate real physical systems. Through density functional theory calculations and finite element analysis, the system generates digital twins of the thin film coatings, allowing virtual testing and optimization without physical experimentation, thus accelerating the design process

Inventive Principle:
Principle #26Copying

2Reliability

If no intermediate layer is used between substrate and coating layer, then the structure is simple, but delamination occurs due to thermal expansion coefficient difference

Engineering Contradiction:
Improveadhesion between coating and substrateVSAvoidstructure complexity with intermediate layers
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies local quality by creating a functionally graded material composition where the material properties gradually transition from the substrate to the coating layer. The system optimizes the composition at each depth position, varying the concentration of alloying elements to locally adjust thermal expansion coefficients and match them between substrate and coating, thereby preventing delamination while managing structural complexity

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent uses composite materials by designing a functionally graded intermediate layer composed of multiple elements (e.g., Cr, Al, Ti) in varying proportions. This composite structure provides gradual property transitions, combining the advantages of both substrate and coating materials while reducing thermal mismatch, thus improving adhesion reliability

Inventive Principle:
Principle #40Composite materials

3Reliability

If functionally graded materials are used to reduce thermal expansion gap, then delamination is suppressed, but much time and money are consumed in selecting and experimenting compositions

Engineering Contradiction:
Improveprevention of delaminationVSAvoidtime for composition selection and experimentation
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent replaces the mechanical trial-and-error experimentation system with computational mechanics. The system uses density functional theory to calculate formation energies and predict stable phases, and employs finite element analysis to simulate thermal stress behavior, substituting physical experimentation with virtual simulation to determine optimal functionally graded material compositions

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent systematically varies composition parameters (concentrations of Cr, Al, Ti, and other elements) and depth position parameters in the functionally graded layer. By changing these parameters in computational models and evaluating their effects on thermal stress and adhesion, the system identifies optimal composition profiles without extensive physical experimentation

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces the time and cost associated with selecting material compositions, prevents delamination, and improves the stability and functionality of thin films by predicting optimal conditions through multi-scale simulation, thereby enhancing the efficiency of thin film design and development.

Implementation Method 1

determining a structure with the lowest energy by moving atoms of molecules through the structural optimization using a density functional theory (DFT) with respect to a composition and structure thereof

Methodology Applied
Scientific EffectDensity functional theory (DFT):

Implementation Method 2

analyze a thermal stress according to composition and thickness arrangement of the functionally graded material by performing multi-scale simulation

Methodology Applied
Scientific EffectThermal stress: Thermal Expansion

Data Source

PatentUS20250094661A1Multi-scale simulation-based functionally graded material design device and method for high temperature environment
Publication Date: 2025.03.20 FOUND OF SOONGSIL UNIV IND COOP
  • US20250094661A1 patent drawing
  • US20250094661A1 patent drawing
  • US20250094661A1 patent drawing

AI summary

One embodiment provides a multi-scale simulation-based functionally graded material design method for a high temperature environment. According to one embodiment, since the characteristics of a functionally graded material (FGM) may be predicted through multi-scale simulation in advance and optimal conditions may be derived, it is possible to reduce the costs required for experiment and manufacture and shorten the manufacturing time.