Focused Ion Beam Conductive Patterning in Insulating Dielectrics

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Solution Overview

Problem

Existing methods for nanopatterning transparent conducting oxides, such as FIB, face limitations in achieving significant conductivity modulation in highly insulating dielectric materials like Al2O3, with previous techniques only achieving a conductivity increase of 4 orders of magnitude.

Innovation Solution

The use of a focused ion beam to irradiate dielectric materials, inducing defects that create conductive features with conductivity up to 15 times greater than the surrounding material, by forming 'deep traps' within the material's band gap, allowing for the creation of embedded conductive features with high conductivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If FIB is used for nanopatterning transparent conducting oxides, then lithographically controlled dopant implantation is achieved, but conductivity modulation in highly insulating dielectric materials is limited to 4 orders of magnitude

Engineering Contradiction:
Improveconductivity modulationVSAvoidapplicability to highly insulating dielectric materials
Core Design Contradiction:
Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The patent changes the fundamental parameter of ion beam interaction with dielectric materials by using focused ion beam irradiation to create deep traps within the band gap, rather than relying on traditional dopant implantation. This parameter change enables conductivity modulation exceeding 14 orders of magnitude in highly insulating materials like Al2O3,突破了 the previous 4 orders of magnitude limitation

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent replaces the mechanical dopant implantation process with a radiation-based mechanism where focused ion beam creates deep traps through energy deposition. This substitution of the physical mechanism enables conductivity modulation in materials that were previously inaccessible to traditional implantation methods

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Productivity

If FIB is used for large-area milling and implantation, then processing speed is improved, but serial processing limitation remains

Engineering Contradiction:
Improvepatterning speedVSAvoidserial processing architecture
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent makes the FIB system universally applicable to both conductive and highly insulating dielectric materials through the deep trap mechanism. The same focused ion beam process that works for TCO nanopatterning now also enables conductivity modulation in Al2O3 and other insulators with >14 orders of magnitude, eliminating the need for material-specific process variations

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent performs preliminary action by creating deep traps within the band gap of dielectric materials before final device operation. This pre-formed conductive pathway approach enables subsequent electrical operation without requiring complex in-situ modification during device use

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method achieves a giant increase in conductivity, up to 14 orders of magnitude, enabling the creation of conductive features with ohmic behavior, suitable for various applications including low-capacitance sensing devices and biomedical implants.

Implementation Method 1

irradiating a region of a dielectric material with a focused ion beam

Methodology Applied
Scientific EffectIon Beam: Ion Beam

Implementation Method 2

Focused Ion Beam (FIB) has proven to be an extremely effective tool for the nanopatterning of transparent conducting oxides (TCO) via lithographically controlled dopant implantation

Methodology Applied
Scientific EffectIon Implantation: Ion Implantation

Data Source

PatentUS20240429092A1Nanoscale resolution, spatially-controlled conductivity modulation of dielectric materials using a focused ion beam
Publication Date: 2024.12.26 NORTHWESTERN UNIV
  • US20240429092A1 patent drawing
  • US20240429092A1 patent drawing
  • US20240429092A1 patent drawing

AI summary

Methods for creating a conductive feature in a dielectric material are provided. In an embodiment, such a method comprises irradiating a region of a dielectric material having a resistivity of at least 108 Ω cm with a focused ion beam, the irradiated region corresponding to a conductive feature embedded in the dielectric material, the conductive feature having a conductivity greater than that of the dielectric material; and forming one or more contact pads of a conductive material in electrical communication with the conductive feature, the one or more contact pads configured to apply a voltage across the conductive feature using a voltage source.