Focused Ion Beam Cross-Section Alignment via Image Superimposition

Solution Overview

Problem

High-resolution cross-section observation in focused ion beam apparatuses is hindered by positional displacement of display regions due to sample stage tilting, causing sample damage from continuous charged-particle beam irradiation during alignment and observation.

Innovation Solution

A method and apparatus that aligns display regions between cross-section images by superimposing and editing image information, using a focused ion beam apparatus with image processing units to correct positional displacement, reducing sample damage by minimizing continuous beam irradiation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the sample stage is tilted and moved to align display regions during cross-section observation, then the display regions can be positioned correctly, but the sample suffers damage from continuous charged-particle beam irradiation

Engineering Contradiction:

Improvealignment precision of display regionsVSAvoidsample damage from beam irradiation

Core Design Contradiction:

Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

The patent creates a virtual model (copy) of the sample surface geometry based on measurement data, and performs alignment operations on this virtual model rather than physically tilting and moving the sample stage during observation. This allows display regions to be aligned through image processing while minimizing continuous beam irradiation to the actual sample.

Inventive Principle:

Principle #26Copying

Solution Approach 2:

The patent replaces the mechanical sample stage tilting and moving mechanism with an information processing approach. Instead of physically adjusting the sample position to align display regions, the system uses computational methods to correct positional displacement in the captured images, thereby eliminating the need for continuous beam irradiation during mechanical alignment operations.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Device complexity

If a focused ion beam apparatus without SEM equipment is used for cut-and-see operation, then the apparatus complexity and cost are reduced, but display region alignment becomes difficult due to sample stage tilting and movement

Engineering Contradiction:

Improveapparatus configuration complexityVSAvoiddisplay region alignment precision

Core Design Contradiction:

Device complexityVSMeasurement precision

Solution Approach 1:

The patent creates a virtual model (copy) of the sample surface geometry based on measurement data, and performs alignment operations on this virtual model rather than physically tilting and moving the sample stage during observation. This allows display regions to be aligned through image processing while minimizing continuous beam irradiation to the actual sample.

Inventive Principle:

Principle #26Copying

Solution Approach 2:

The patent replaces the mechanical sample stage tilting and moving mechanism with an information processing approach. Instead of physically adjusting the sample position to align display regions, the system uses computational methods to correct positional displacement in the captured images, thereby eliminating the need for continuous beam irradiation during mechanical alignment operations.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the acquisition of aligned observation images with reduced sample damage by correcting positional displacement through image superimposition and editing, ensuring precise alignment without continuous beam exposure.

Implementation Method 1

forming a first cross section in a sample by etching processing using a focused ion beam

Methodology Applied

Scientific EffectFocused ion beam etching: Ion Beam

Implementation Method 2

obtaining image information of the first cross section by irradiating the focused ion beam to the first cross section

Methodology Applied

Scientific EffectSecondary electron emission: Electron Beam

Data Source

PatentUS8542275B2Method and apparatus for cross-section processing and observation

Publication Date: 2013.09.24 HITACHI HIGH TECH ANALYSIS CORP

AI summary

A cross-section processing and observation method includes: forming a first cross section in a sample by etching processing using a focused ion beam; obtaining image information of the first cross section by irradiating the focused ion beam to the first cross section; forming a second cross section by performing etching processing on the first cross section; obtaining image information of the second cross section by irradiating the focused ion beam to an irradiation region including the second cross section; displaying image information of a part of a display region of the irradiation region from the image information of the second cross section; displaying the image information of the first cross section by superimposing it on the image information being displayed; and moving the display region within the irradiation region. Observation images in which display regions are aligned can be obtained while reducing damage to the sample.