Passive Fiber Alignment via Semiconductor Etched Trenches
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Solution Overview
Problem
The alignment of optical components to waveguides in the photonics industry is challenging due to the need for expensive, high-resolution equipment and active alignment methods, which slow down the fabrication process and limit throughput.
Innovation Solution
An optical system with a fiber array connector and photonic chip design that uses machined grooves and trenches on a substrate to passively align fibers with waveguides, where one fiber registers with an alignment trench to align all fibers to respective waveguides, eliminating the need for active alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If active alignment equipment is used to align optical components to waveguides, then alignment precision is improved, but fabrication speed and throughput deteriorate
Solution Approach 1:
The patent pre-forms alignment trenches and registration features on the photonic chip before fiber coupling. These pre-formed structures guide the fibers into proper alignment positions, eliminating the need for time-consuming active alignment during fabrication. The alignment trenches are created using standard semiconductor processing techniques, enabling passive alignment that maintains precision while dramatically improving fabrication throughput.
Solution Approach 2:
The patent replaces the mechanical active alignment system (with cameras and multi-stage axes) with a passive alignment system based on pre-formed semiconductor etched features. The alignment trenches and registration structures provide mechanical guidance that automatically positions fibers correctly without requiring expensive active alignment equipment, thus improving both precision and productivity.
2Manufacturing precision
If active alignment equipment is used to align optical components, then alignment precision is improved, but equipment cost increases
Solution Approach 1:
The patent replaces expensive active alignment equipment (cameras, multi-stage axes, active monitoring systems) with simple passive alignment structures formed by standard semiconductor processing. The alignment trenches and registration features provide sufficient precision without requiring complex alignment equipment, dramatically reducing equipment costs while maintaining alignment quality.
Solution Approach 2:
The patent uses inexpensive semiconductor etched features (alignment trenches, registration structures) that can be formed using standard processing techniques. These simple passive alignment structures replace expensive, complex active alignment equipment, providing cost-effective alignment without sacrificing precision.
3Manufacturing precision
If active monitoring of coupled light is used, then alignment precision is improved, but fabrication time increases
Solution Approach 1:
The patent pre-forms alignment trenches and registration features on the photonic chip before fiber coupling. These pre-formed structures provide passive alignment guidance that eliminates the need for time-consuming active light monitoring during alignment, reducing fabrication time while maintaining precision through the pre-engineered alignment structures.
Data Source
AI summary
Embodiments herein include an optical system that passively aligns a fiber array connector (FAC) to a waveguide in a photonic chip. A substrate of the FAC is machined or etched to include multiple grooves along a common axis or plane to hold optical waveguides, or more specifically, the fibers of the optical cables in the FAC. To align the fibers to the photonic chip, one of the fibers is disposed in an alignment trench which has a width that is substantially the same as the diameter of the fiber. When the fiber registers with the alignment trench, the fiber is aligned with a waveguide disposed at the end of the trench. Because the pitch between the fibers can be precisely controlled, aligning one of the fibers using the alignment trench results in the other fibers becoming passively aligned to respective waveguides in the photonic chip.