Fiber Array Connector Holder for Solder Reflow Alignment Stability
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Solution Overview
Problem
Conventional methods for assembling optoelectronic package assemblies with fiber array units often result in component stress and increased manufacturing costs due to the need for temporary removal and reinstallation of optical components during soldering, as well as challenges in optical alignment post-soldering, leading to potential component failure and signal loss.
Innovation Solution
A method involving a connector holder with an engagement feature that retains a fiber array unit's connector, allowing optical fibers to be optically coupled to a substrate with optical waveguides, and then subjected to controlled heating and cooling to secure the assembly without altering the fiber array's alignment, ensuring dimensional stability during solder reflow processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If optical components are temporarily removed during electronic component soldering, then soldering can be performed without optical alignment interference, but component stress and potential failure occur due to removal and reinstallation
Solution Approach 1:
The patent applies preliminary action by performing optical alignment of the fiber array unit to the substrate waveguides before the soldering process. The fiber array unit is positioned and aligned on the substrate prior to heating, so that when soldering occurs, the optical components remain in place and already aligned. This eliminates the need for temporary removal and reinstallation, preventing component stress while maintaining manufacturing feasibility.
2Productivity
If optical components are aligned after electronic components are soldered, then assembly sequence is simplified, but alignment difficulty and manufacturing cost increase
Solution Approach 1:
The patent performs optical alignment as a preliminary action before soldering, rather than after. The fiber array unit is aligned to the substrate waveguides in advance, and this preliminary alignment is maintained through the subsequent soldering process. This approach simplifies the alignment operation itself (performed once on stable components) while maintaining straightforward assembly sequence, avoiding the difficulties of post-solder alignment.
Solution Approach 2:
The patent segments the assembly process into distinct phases: first assembling and aligning the fiber array unit with the substrate, then performing soldering separately. This segmentation allows optical alignment to be performed on a stable, non-heated assembly where precision is easier to achieve, while the soldering process is handled as a separate thermal operation that follows.
3Manufacturing precision
If fiber array unit is retained on substrate during solder reflow, then alignment can be maintained, but dimensional stability must be ensured to prevent alignment changes
Solution Approach 1:
The patent addresses dimensional stability by carefully controlling thermal parameters during the solder reflow process. The heating is performed within a specific temperature range (200-300°C) and time duration that melts the solder but minimizes thermal expansion and dimensional changes of the fiber array unit and substrate. By optimizing these thermal parameters, the assembly maintains dimensional stability while still allowing solder reflow, thereby preserving optical alignment precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces component stress, minimizes manufacturing costs, and maintains precise optical alignment, enabling the optoelectronic package assembly to endure solder reflow processes without significant alignment changes, thus enhancing the reliability and efficiency of the assembly process.
Implementation Method 1
heating the connector holder, the fiber array unit, the substrate, and a solder positioned between the substrate and a base substrate, where the heating is sufficient to melt the solder
Implementation Method 2
cooling the solder to couple the substrate to the base substrate
Implementation Method 3
optically coupling the optical fibers to the optical waveguides of the substrate such that the optical fibers to the optical waveguides have a lateral alignment between the optical fibers and the optical waveguides
Data Source
AI summary
A method for assembling an optoelectronic package assembly includes engaging a connector holder with a substrate, the connector holder defining an engagement feature and the substrate including optical waveguides, engaging a connector of a fiber array unit with the engagement feature the connector holder where the engagement feature retains the connector and where the fiber array unit includes the connector and optical fibers coupled to the connector, optically coupling the optical fibers to the optical waveguides of the substrate, heating the connector holder, the fiber array unit, the substrate, and a solder positioned between the substrate and a base substrate, where the heating is sufficient to melt the solder, and cooling the solder to couple the substrate to the base substrate.