Optical Fiber Bonding via Laser Welding and Thin Film Mediators

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The existing methods for bonding optical fibers to substrates in fiber arrays often result in misalignment, leading to signal degradation or prevention of optical signals passing between connectors and devices, and residual stress from the laser welding process can cause cracks over time due to thermal expansion differences between the fiber and substrate materials.

Innovation Solution

The method involves depositing thin film layers on the substrate to promote heating and absorption of a laser beam, optimizing the film thickness and absorption to minimize stress and metallic aggregation, and using mid-IR lasers to tune the laser wavelength and power for precise bonding, while also cutting the fiber array sections away from the laser bond zones to reduce stress concentrations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If laser welding is used to bond optical fibers to substrates, then bonding strength is improved, but residual stress causes cracks over time

Engineering Contradiction:
Improvebonding strengthVSAvoidcrack resistance
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

A metal film layer is deposited on the substrate surface to act as an intermediary between the optical fiber and substrate. This film layer absorbs laser energy and facilitates bonding while reducing residual stress. The film shatters into nano-particles during laser welding, creating a controlled interface that maintains bonding strength while minimizing stress-induced cracks.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The thickness of the metal film layer is precisely controlled (optimized) to balance bonding strength and stress reduction. By adjusting the film thickness parameter, the process achieves strong bonding while the film shatters into fine nano-particles that reduce residual stress concentrations, preventing crack formation over time.

Inventive Principle:
Principle #35Parameter changes

2Use of energy by moving object

If film layer thickness is increased to promote laser absorption, then heating efficiency is improved, but metallic aggregation increases

Engineering Contradiction:
Improvelaser absorption efficiencyVSAvoidmetallic aggregation
Core Design Contradiction:
Use of energy by moving objectVSStability of the object's composition

Solution Approach 1:

The film layer thickness is optimized to a specific range that maximizes laser absorption efficiency while preventing excessive metallic aggregation. This parameter optimization ensures the film absorbs sufficient laser energy for effective heating and bonding without forming large aggregates that would compromise bond quality.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The laser welding process is optimized to deliver energy rapidly, causing the metal film to shatter into nano-particles before significant aggregation can occur. This rapid processing approach allows efficient laser absorption while maintaining compositional stability by preventing large-scale metallic aggregation.

Inventive Principle:
Principle #21Skipping (Rushing through)

3Productivity

If laser power is increased to improve bonding, then bonding speed is improved, but residual stress increases causing cracks

Engineering Contradiction:
Improvebonding speedVSAvoidcrack resistance
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The metal film layer serves as a mediator that absorbs laser energy efficiently, enabling faster bonding speeds. The film's controlled shattering into nano-particles dissipates excess energy and reduces residual stress, allowing high-power laser welding without causing stress-induced cracks.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The film thickness parameter is optimized to work synergistically with laser power settings. This optimization allows increased laser power for faster bonding while the film's controlled disintegration into fine particles prevents excessive stress accumulation, maintaining crack resistance despite higher bonding speeds.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures precise alignment and bonding of optical fibers, reduces residual stress, and minimizes the risk of crack formation by optimizing the laser welding process and using a combination of adhesive and laser bond zones for secure and durable connections.

Implementation Method 1

directing a laser beam into the optical fiber disposed on the at least one film layer

Methodology Applied
Scientific EffectLaser heating: Laser

Implementation Method 2

melting, using the focused diameter laser beam, at least one of a material of the substrate and a material of the optical fiber to create a laser bond area

Methodology Applied
Scientific EffectMelting: Melting

Implementation Method 3

The at least one film layer has an absorption of at least 15% at a wavelength of the focused diameter laser beam

Methodology Applied
Scientific EffectAbsorption of optical radiation: Absorption (EM radiation)

Data Source

PatentUS11422310B2Methods of bonding an optical fiber to a substrate using a laser and assemblies fabricated by the same
Publication Date: 2022.08.23 CORNING INC
  • US11422310B2 patent drawing
  • US11422310B2 patent drawing
  • US11422310B2 patent drawing

AI summary

Methods for laser welding one or more optical fibers to a substrate and assemblies are disclosed. In one embodiment, a method of bonding an optical fiber to a substrate having at least one film layer on a surface of the substrate includes directing a laser beam into the optical fiber disposed on the at least one film layer. The optical fiber has a curved surface that focuses the laser beam to a focused diameter. The method further includes melting, using the focused diameter laser beam, a material of the substrate to create a laser bond area between the optical fiber and the surface of the substrate. The laser bond area includes laser-melted material of the substrate that bonds the optical fiber to the substrate. The at least one film layer has an absorption of at least 15% at a wavelength of the focused diameter laser beam.