Coherent Fiber Bundle Display with Molded Polymer Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Electronic devices with displays face challenges in protecting sensitive display structures from damage while minimizing border sizes and maintaining a desired appearance, as existing solutions do not effectively integrate image transport layers with display cover layers and housing structures.
Innovation Solution
An electronic device is designed with a coherent fiber bundle image transport layer between the display and the display cover layer, supported by molded polymer, which helps minimize borders and protect the display edges, and allows for the attachment of electronic components and housing structures using threaded openings and fasteners.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a display cover layer is provided to protect sensitive display structures, then the display is protected from damage, but the border size increases and the appearance is compromised
Solution Approach 1:
The patent embeds the coherent fiber bundle within a molded polymer structure that is integrated into the display cover layer. The fiber bundle is nested within recesses of the polymer, creating a compact assembly that eliminates the need for separate protective borders while maintaining display protection through the integrated structure.
Solution Approach 2:
The patent combines multiple functions into a single integrated structure: the molded polymer serves as both the protective cover layer and the mounting structure for the coherent fiber bundle. This merging of protective and structural functions eliminates the need for separate border elements, reducing overall border size while maintaining protection.
2Device complexity
If the coherent fiber bundle is mounted directly to the display cover layer, then the structure is simplified, but the bent edge of the display becomes vulnerable to damage
Solution Approach 1:
The molded polymer structure incorporates recesses and integrated mounting features that are formed beforehand during the molding process. These pre-formed structures provide protective support for the bent display edges before assembly, preventing damage during installation and use without requiring additional protective measures.
3Adaptability or versatility
If threaded openings are added to the molded polymer for mounting components, then the versatility of mounting options increases, but the manufacturing complexity increases
Solution Approach 1:
The threaded openings and mounting features are incorporated into the molded polymer structure during the initial molding process rather than being added as separate post-processing steps. This preliminary formation of mounting features enables versatile component mounting while maintaining manufacturing efficiency through integration with the base polymer fabrication process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively protects the display edges, minimizes border sizes, and provides a secure mounting system for components, enhancing the durability and appearance of electronic devices by using a coherent fiber bundle and molded polymer to integrate the image transport layer with the display and housing.
Implementation Method 1
an image transport layer formed from a coherent fiber bundle. The coherent fiber bundle may have an input surface that receives an image from the display and a corresponding output surface to which the image is provided through the coherent fiber bundle
Implementation Method 2
Adhesive in the gap may attach the coherent fiber bundle to the display cover layer. Molded polymer may be used to support the coherent fiber bundle relative to the display cover layer
Data Source
AI summary
An electronic device may have a display, a display cover layer, and an image transport layer formed from a coherent fiber bundle. The coherent fiber bundle may be placed between the display and the display cover layer. A gap may separate the coherent fiber bundle from the display cover layer. Adhesive in the gap may attach the coherent fiber bundle to the display cover layer. Molded polymer may be coupled to a bent edge of the display, a portion of the display with backside contacts, or components coupled to the backside contacts or other portions of the display. The molded polymer may support the coherent fiber bundle relative to the cover layer. The molded polymer may be molded to an inner surface of the cover layer and may be used to receive fasteners or otherwise facilitate mounting of housing structures and components in the device.


