Fiber-Structured Capacitor Dielectric Layout for Short-Circuit Reduction
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Solution Overview
Problem
Capacitors with fiber-shaped conductive members that vary in number density along their length face issues with short circuit paths due to exposed conductive members, and increasing dielectric layer thickness to mitigate this reduces capacitance density.
Innovation Solution
A capacitor design where the fiber-shaped conductive members are divided into proximal and distal halves with varying number densities and dielectric layer thicknesses, with the thicker dielectric layer applied to the higher density distal half to minimize exposed sites and maintain capacitance density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thickness of the dielectric layer is increased to reduce exposed conductive members, then the number of short circuit paths is reduced, but the capacitance density decreases
Solution Approach 1:
The patent applies local quality by making the dielectric layer thickness non-uniform along the fiber-shaped conductive members. Specifically, the dielectric layer has a first thickness in a first region and a second thickness greater than the first thickness in a second region. This gradient thickness distribution allows the dielectric layer to provide sufficient insulation coverage where needed while maintaining optimal capacitance in other regions, thereby resolving the contradiction between reducing short circuit paths and maintaining capacitance density.
2Reliability
If the dielectric layer thickness is uniformly increased, then exposed sites are reduced, but the overall capacitance density of the capacitor decreases
Solution Approach 1:
The patent implements local quality by creating a spatially varying dielectric layer thickness. The dielectric layer thickness transitions from a first thickness in a first region to a second thickness in a second region, where the second thickness is greater than the first thickness. This localized thickness variation ensures adequate coverage of conductive members in regions where exposure is problematic while preserving capacitance density in regions where thinner dielectric layers are beneficial.
Solution Approach 2:
The patent applies segmentation by dividing the dielectric layer into distinct thickness regions along the fiber-shaped conductive members. The dielectric layer is segmented such that different portions have different thicknesses, with a first thickness in a first region and a second thickness in a second region. This segmentation allows optimized performance in different zones, preventing uniform thickness from causing either excessive exposure or unnecessary capacitance loss.
Data Source
AI summary
A capacitor that includes: a substrate with conductivity; a plurality of fiber-shaped conductive members on the substrate and electrically connected to the substrate; a dielectric layer covering a surface of the plurality of fiber-shaped conductive members; and a conductor layer covering a surface of the dielectric layer, where the plurality of fiber-shaped conductive members includes a proximal half present proximally to the surface of the substrate and a distal half present distally to the surface of the substrate, and one of the proximal half and the distal half is higher in the number density of the plurality of fiber-shaped conductive members and larger in the thickness of the dielectric layer than the other of the proximal half and the distal half.