Electronic Circuits Deposited on Fibers for Wearable Integration
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Solution Overview
Problem
Existing methods for integrating portable electronic devices into clothing lack full integration of complex electrical structures, requiring separate attachment and connection of microprocessors and control circuits, which compromises comfort and convenience.
Innovation Solution
Electrical components such as transistors, capacitors, and antenna elements are directly formed onto fibers, which are then woven into fabric to create wearable items like clothing and shoes, enabling more comprehensive integration of electronic circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If portable electronic devices are integrated into clothing using conductive fibers and separate circuit attachments, then electronic functionality is achieved, but device complexity and discomfort increase due to separate attachments and connections
Solution Approach 1:
The patent merges the electronic circuit components directly onto the fiber surface, combining what were previously separate elements (conductive fibers, microprocessors, control circuits) into an integrated structure where circuits are deposited directly on the fiber, eliminating the need for separate attachments and connections
Solution Approach 2:
The fiber serves multiple functions simultaneously: it provides the structural basis of the textile while also carrying the electronic circuitry, making the fiber both a mechanical support and an electronic substrate, thereby reducing overall device complexity
2Adaptability or versatility
If portable electronic devices are integrated into clothing using conductive fibers and separate circuit attachments, then electronic functionality is achieved, but user comfort deteriorates due to bulky and uncomfortable separate components
Solution Approach 1:
By merging the electronic circuits directly onto the fiber surface, the invention eliminates bulky separate attachments and connections, creating a streamlined integrated structure that is more comfortable for the user to wear and operate
3Device complexity
If fibers include complex electrical structures directly deposited on them, then full integration of electronic circuits is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent replaces traditional mechanical assembly methods (separately attaching microprocessors and control circuits to fabric) with a deposition process where circuits are directly formed onto the fiber surface, simplifying the manufacturing workflow despite the increased integration level
Data Source
AI summary
Fibers, such as textile fibers, having electrical components deposited thereon. More particularly, one or more electrical components are formed directly onto the surface of at least one fiber. The fiber having the electrical component formed thereon may then be interlaced with other fibers for form a larger piece of fabric, which can be employed to produce an article of clothing. A group of transistors and piezoelectric components forming an accelerometer may be woven onto one or more natural or synthetic fibers. The fibers may then be employed as the warp, weft, or both, of a woven piece of fabric, or used to form a knitted piece of fabric. The fabric piece can then be cut and sewn to form a wearable item, such as a shirt, a pair of pants, a hat, or the upper piece of a shoe that includes the accelerometer.