Fiber Composite Circuit Carrier Plate With Insert Gaps
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Solution Overview
Problem
Current methods for producing circuit boards with fiber composite materials are limited in efficiently integrating inserts with different materials or properties, which can affect thermal conductivity and electrical connectivity, particularly for heat dissipation in electronic components.
Innovation Solution
A method involving a fiber composite base body with strategically created openings for inserts, where a filling material is introduced into gaps between the insert and the base body, allowing for precise definition of the gap width and material properties, such as using epoxy resin and thermally conductive ceramic inserts, to enhance thermal and electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If inserts with different materials are integrated into the base body, then thermal conductivity and electrical connectivity are improved, but manufacturing complexity increases
Solution Approach 1:
The base body is divided into multiple regions with different material properties by integrating inserts with different materials (e.g., ceramic inserts for thermal conductivity, metallic inserts for electrical connectivity) into specific openings in the fiber composite base body, allowing each region to be optimized for its specific function
Solution Approach 2:
The patent uses composite material construction by combining fiber composite base body material with inserts of different materials (ceramic, metal, plastic) to create a multi-material structure that achieves superior thermal and electrical properties that cannot be obtained with a single material
2Manufacturing precision
If gap width between insert and base body is reduced, then manufacturing precision is improved, but ease of manufacture deteriorates
Solution Approach 1:
A filler material is introduced as an intermediary substance into the gap between the insert and the base body. This filler material allows for controlled gap widths while maintaining ease of manufacture, as the filler can be injected to fill the gap uniformly without requiring extremely tight tolerances on the insert and opening dimensions
Solution Approach 2:
The gap width parameter is optimized to a specific range (0.1-0.4mm) that balances manufacturing precision requirements with ease of manufacture. This parameter change allows sufficient space for filler material introduction while maintaining adequate positioning precision
3Adaptability or versatility
If inserts are integrated into openings in the base body, then adaptability of material properties is improved, but device complexity increases
Solution Approach 1:
The base body design with standardized openings allows for universal integration of different types of inserts (ceramic, metal, plastic) with different material properties. The same basic structure and process can accommodate various insert materials and configurations, providing multi-functionality and adaptability without proportionally increasing device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the efficient production of circuit boards with improved thermal conductivity and electrical connectivity, effectively addressing the integration challenges of different material properties and enhancing heat dissipation capabilities for electronic components.
Implementation Method 1
introducing a filler material into the at least one gap
Implementation Method 2
at least one insert comprises at least one material with a thermal conductivity greater than that of the base body, in particular at least one ceramic material, preferably comprising aluminum nitride
Data Source
Figure 1~9
Figure 2~3
Figure 4A~4C
AI summary
Method for manufacturing a circuit board with a base body comprising a fiber composite material, comprising the following steps: providing the base body, making at least one opening in the base body, inserting at least one insert into the at least one opening such that at least one gap remains between at least one side wall of the insert and a side wall of the opening, inserting a filler material into the at least one gap.