Fiber Composite Security Document Monocoque Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing security and valuable documents, such as ID cards, lack sufficient mechanical stability, particularly when equipped with electronic circuits and display devices, leading to potential damage from bending stress and exposure of electrical components.
Innovation Solution
A security document with a monocoque structure formed by a fiber composite support structure layer and a circuit carrier layer, using non-fusible materials like thermoset-reinforced glass fiber composites, which provides high torsional rigidity and protects electronic components from mechanical damage, and an RFID circuit with an integrated fingerprint scanning device and display.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If polymer materials are used for document layers, then flexibility and ease of manufacture are improved, but mechanical stability and torsional rigidity deteriorate
Solution Approach 1:
The patent applies composite materials by combining a fiber-reinforced support structure layer (made of glass fiber reinforced plastic or similar composite materials) with polymer circuit carrier layers. This composite construction provides both the mechanical stability and torsional rigidity needed for security documents while maintaining flexibility in manufacturing processes. The fiber reinforcement specifically addresses the weakness of pure polymer materials in providing structural strength.
2Adaptability or versatility
If electronic components are mounted on circuit carrier layers, then functionality is improved, but vulnerability to mechanical damage increases
Solution Approach 1:
The patent implements beforehand cushioning by creating a protective sandwich structure where the fiber-reinforced support structure layer is positioned to protect the electronic components mounted on the circuit carrier layer. The rigid composite layer acts as a protective shell that absorbs and distributes mechanical stresses before they can reach the vulnerable electronic components, thereby preventing breakage and damage in advance.
Solution Approach 2:
The use of fiber-reinforced composite materials for the support structure provides enhanced mechanical protection for electronic components. The composite structure's high strength-to-weight ratio and torsional rigidity create a protective environment that shields mounted electronics from bending, crushing, and other mechanical damages while maintaining the document's overall flexibility.
3Ease of manufacture
If lamination processes are used to assemble document layers, then ease of manufacture is improved, but dimensional stability under thermal influences deteriorates
Solution Approach 1:
The patent addresses thermal dimensional stability by carefully selecting materials with compatible thermal expansion coefficients and optimizing the lamination process parameters (temperature, pressure, time). The fiber-reinforced composite support structure layer has low thermal expansion characteristics that counteract the thermal effects on polymer layers, maintaining dimensional stability throughout the lamination process and during document use under varying thermal conditions.
Data Source
Figure 1A~1B
Figure 2(A)~2(B)
Figure 3(A)~3(D)
AI summary
In order to create a value or security document (1000) comprising an electronic circuit (1270) with greater mechanical stability, in particular in respect of bending stress, the value or security document (1000) is formed of at least two stacked document layers (1100, 1200, 1300, 1400) that are connected to one another using a joining process, the stack being formed by a supporting structural layer (1100) and a circuit carrier layer (1230) that carries the electronic circuit (1270). The supporting structural layer (1100) is made of a fiber composite.