Fiber Structure Cooling Device for Thermal Stability
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Solution Overview
Problem
The existing cooling devices for electronic components face challenges in establishing a mechanically stable and thermally effective connection between heating tubes and cooling elements, leading to increased manufacturing costs, larger installation spaces, and thermal resistance issues due to the use of thermally-conductive adhesives that can clump or become brittle.
Innovation Solution
A cooling device with a heating tube and a cooling element where the heating tube surface features a fiber structure that forms a mechanical and thermal connection with the cooling element surface, eliminating the need for thermally-conductive adhesives by bridging microscopic gaps and enhancing the material-bonded connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermally-conductive adhesive is used to connect heating tube and cooling element, then thermal coupling is improved, but thermal resistance increases over time due to adhesive clumping and brittleness
Solution Approach 1:
The patent removes the thermally-conductive adhesive from the connection system entirely. Instead of using adhesive between the heating tube and cooling element, the invention uses a fiber structure integrated into the heating tube that directly contacts the cooling element surface, eliminating the adhesive layer and its associated thermal resistance problems.
Solution Approach 2:
The fiber structure acts as an intermediary between the heating tube and cooling element. These fibers provide both mechanical support and thermal conduction pathways, replacing the adhesive's function while maintaining superior thermal performance and long-term stability.
2Reliability
If thermally-conductive adhesive is applied to ensure thermal contact, then thermal connection is improved, but manufacturing complexity and time increase
Solution Approach 1:
The patent combines the mechanical support function and thermal conduction function into a single integrated fiber structure. This eliminates the need for separate adhesive application, drying, and surface finishing operations, simplifying the manufacturing process while maintaining reliable thermal connection.
Solution Approach 2:
The fiber structure is self-supporting and self-aligning within the heating tube. During injection molding, the fibers automatically position themselves to provide both structural integrity and thermal pathways, eliminating the need for external adhesive materials and complex assembly steps.
3Strength
If heating tube is injected into cooling element slot under pressure, then mechanical connection is established, but material unevenness and residues remain requiring additional milling
Solution Approach 1:
The fiber structure is concentrated specifically at the connection interface between the heating tube and cooling element. This localized fiber reinforcement provides enhanced mechanical bonding and thermal conduction exactly where needed, while the rest of the heating tube maintains its standard structure, avoiding the need for additional surface finishing operations.
4Manufacturing precision
If slot recess is milled into cooling element for heating tube, then precise fit is achieved, but manufacturing time and costs increase
Solution Approach 1:
The connection interface is segmented into multiple fiber elements distributed within the heating tube wall. These individual fibers collectively provide both mechanical strength and thermal conduction, replacing the need for a precisely milled slot while achieving comparable or superior connection quality through the injection molding process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a more stable mechanical connection and improved thermal coupling, reducing thermal resistance and preventing adhesive-related issues, thus enhancing the efficiency and reliability of heat dissipation in electronic devices.
Implementation Method 1
a heating tube surface of the heating tube in the region surrounded by the slot recess has a fiber structure consisting of first fibers... form a mechanical connection to a cooling element surface of the cooling element
Implementation Method 2
the first fibers of the heating tube surface of the heating tube in the region of the slot recess form a mechanical connection to a cooling element surface of the cooling element... bridging microscopic gaps
Data Source
AI summary
A cooling device for heat dissipation from an electronic component includes a heating tube having a heating tube surface, a cooling element having a first cooling element side formed with a slot recess which at least partially encloses the heating tube, and a fiber structure made of fibers and arranged on the heating tube surface in a region in which the heating tube is at least partially enclosed by the slot recess. The fibers on the heating tube surface of the heating tube in the region of the slot recess form a mechanical connection with a cooling element surface of the cooling element.