Fiber-Coupled Diode Laser Beam Shaping for Thick-Material Cutting
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Solution Overview
Problem
Single-mode fiber lasers have poor cutting efficiency for medium to thick materials due to their beam profile, resulting in thin cuts, canting issues, and poor surface quality, necessitating the use of CO2 lasers for thicker materials, which have poorer beam quality factors.
Innovation Solution
A fiber-coupled diode laser system with a variable beam parameter product is achieved by using a substrate to adjust the beam axis offset, divergence, and spot size before coupling into a fiber with a higher beam parameter product, allowing for a range of beam profiles from spot to donut, enabling efficient cutting and welding of various material thicknesses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If single-mode fiber lasers are used for laser material processing, then high power and good beam parameter product are achieved, but cutting efficiency for medium to thick materials deteriorates due to thin cut width and poor material ejection
Solution Approach 1:
The patent employs dynamic beam shaping through variable aperture masks that can be adjusted during operation. This allows the beam profile to change from concentrated single-mode to distributed multi-mode patterns, enabling the same laser system to optimize for both high power applications and efficient material processing across different thicknesses
Solution Approach 2:
The invention changes the beam parameter product by introducing optical elements (lenses, mirrors, aperture masks) that modify the beam's spatial distribution. By adjusting focal length, beam waist position, and aperture size, the system transforms the beam characteristics to achieve optimal cutting performance for different material thicknesses while maintaining high power
2Power
If single-mode laser beam profile is used for cutting, then high power delivery is achieved, but cut quality deteriorates due to poor surface roughness and edge squareness
Solution Approach 1:
The patent applies local quality modification by using aperture masks and optical elements that create specific intensity distributions across the beam profile. This allows different regions of the beam to have optimized characteristics - central regions for penetration and outer regions for edge quality - thereby improving both surface roughness and edge squareness while maintaining power delivery
3Productivity
If CO2 lasers are used for processing thicker materials, then cutting efficiency improves, but beam quality factor deteriorates due to wavelength differences
Solution Approach 1:
The patent creates a universal laser processing system that can handle both thin and thick materials efficiently. By incorporating adjustable beam shaping optics, a single 1μm wavelength laser system replaces the need for separate CO2 lasers, achieving multi-functionality across different material thicknesses while maintaining consistent beam quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system allows for optimized beam characteristics across different material thicknesses, improving cut quality and efficiency, enabling the use of a single laser system for both thin and thick materials, overcoming the limitations of single-mode lasers and CO2 lasers.
Implementation Method 1
A substrate for creating an offset of the beam axis
Implementation Method 2
A focusing lens
Data Source
AI summary
The invention relates to an apparatus and method for varying the beam parameter product of diode lasers in laser material processing. The present invention provides an apparatus for laser material processing, comprising laser diodes as a laser source; a focusing lens; a fiber into which the light is coupled, wherein the beam parameter product of the fiber is greater than the beam parameter product of the incident laser light; and a substrate for producing an offset of the beam axis.