Fiber Laser Packaging With Thin-Film Cooling Plate
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Solution Overview
Problem
Current fiber laser packaging systems face inefficiencies in heat removal, leading to reduced performance and increased costs due to the need for larger potting materials and non-uniform thermal conductivity, which limits the achievable output power and increases cooling requirements.
Innovation Solution
A wound fiber laser spiral is constructed using a metal ribbon and thermal interface material, minimizing potting material and allowing for direct contact with a thin, thermally conductive cooling plate with flow channels, optimizing thermal performance and reducing cooling demands.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional cooling plates with machined grooves and tubing are used, then heat removal is achieved, but the system requires large amounts of potting material and has non-uniform thermal conductivity
Solution Approach 1:
The patent replaces traditional rigid cooling plates with thin-film flexible cooling elements that can be directly applied to the fiber laser coil. These thin films provide uniform thermal contact without requiring large volumes of potting material, achieving efficient heat removal while minimizing material usage.
Solution Approach 2:
The cooling function is merged directly with the fiber laser packaging structure. The thin-film cooling element is integrated into the packaging assembly, eliminating the need for separate cooling plates and reducing the overall system complexity and material requirements.
2Temperature
If traditional cooling plates with machined grooves are used, then heat removal is achieved, but the thermal conductivity is non-uniform
Solution Approach 1:
Thin-film cooling elements provide inherently uniform thermal contact across the fiber laser coil surface. The flexibility of the thin film allows it to conform to the coil geometry, ensuring consistent thermal conductivity without requiring complex machining operations.
Solution Approach 2:
The patent replaces mechanical machining processes (grooving and tubing installation) with thin-film deposition or lamination processes. This substitution achieves uniform thermal conductivity through the inherent properties of the thin film material rather than through mechanical precision.
3Power
If fiber laser power is increased, then output power increases, but heat generation increases requiring more cooling
Solution Approach 1:
The thin-film cooling elements provide superior thermal contact and heat dissipation capability compared to traditional cooling methods. This enables the fiber laser system to handle higher power levels by efficiently removing the increased heat generation, allowing output power to be scaled up without proportional increases in cooling system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances heat dissipation, increases achievable output power, and reduces cooling requirements, leading to more efficient and cost-effective fiber laser systems.
Implementation Method 1
A wound fiber laser spiral is constructed using a metal ribbon and thermal interface material, minimizing potting material and allowing for direct contact with a thin, thermally conductive cooling plate
Implementation Method 2
direct contact with a thin, thermally conductive cooling plate with flow channels
Implementation Method 3
This approach enhances heat dissipation, increases achievable output power, and reduces cooling requirements
Data Source
AI summary
A packaged fiber laser may include a wound fiber laser spiral including a metal ribbon having ends, surfaces, and edges; a fiber laser on a first one of the surfaces of the metal ribbon; and a metal sheet coupled to a first one of the edges of the metal ribbon or a second one of the surfaces of the metal ribbon. Packaging for a fiber laser may include a cooling plate coupled to a second one of the edges of the metal ribbon or the second surface of the metal ribbon, the cooling plate including: a casing including a cover, a bottom, and an outer sidewall; flow channels formed inside the casing, the flow channels defined by inner sidewalls of the cooling plate, wherein the cover is coupled to a top of the inner sidewalls to enclose the flow channel; and an inlet to deliver coolant to the flow channels.