Fiber Optic Connector Casing With Conductive Shielding And Solder Pads
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Solution Overview
Problem
Current fiber optic transceivers and connectors are complex, leading to inefficient assembly processes, restricted material selection, and increased costs due to requirements for specific soldering processes and materials that can withstand high reflow temperatures, making it difficult to meet performance and quality standards.
Innovation Solution
A casing or packaging for fiber optic transceivers with electrically conductive surfaces for electromagnetic shielding and solder pads that provide both electrical connectivity and thermal coupling, allowing for improved thermal management and assembly efficiency, including the use of metal or conductive polymer materials and a pinless design that simplifies construction and reduces assembly risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional fiber optic transceiver designs are used with multiple separate components (electronic components, photonics components, interconnection elements, optical elements, electromagnetic shielding components), then the functionality and performance requirements are met, but the assembly process becomes complex, time-consuming, and costly
Solution Approach 1:
The patent combines electromagnetic shielding components, heat dissipation components, and electrical connection components into a single integrated casing structure. This merging eliminates the need for separate assembly steps for these components, significantly simplifying the assembly process while maintaining all necessary functions for performance and reliability.
Solution Approach 2:
The casing is designed to perform multiple functions simultaneously: providing electromagnetic shielding, dissipating heat, establishing electrical connections, and offering mechanical support. This multi-functionality reduces the total number of components needed and simplifies the overall assembly process while meeting all performance requirements.
2Reliability
If materials suitable for optical path are used, then optical performance is optimized, but reflow soldering becomes difficult due to temperature constraints
Solution Approach 1:
The patent divides the assembly into two temperature-regime zones: the optical components are protected from high temperatures through the casing structure, while the electronic components on the circuit board can undergo reflow soldering. This segmentation allows optical materials to maintain their performance while enabling standard reflow soldering processes for electronic assembly.
3Reliability
If traditional assembly methods requiring multiple separate components are used, then functional requirements are met, but manufacturing time and costs increase
Solution Approach 1:
By integrating electromagnetic shielding, heat dissipation, and electrical connection functions into a single casing component, the patent reduces the number of assembly steps. This merging directly improves manufacturing efficiency by eliminating multiple separate assembly operations while maintaining all necessary functional performances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the performance and reliability of fiber optic communication systems by optimizing thermal coupling, electrical connectivity, and electromagnetic shielding, while simplifying the assembly process and reducing material restrictions, thereby improving manufacturing efficiency and meeting performance and quality standards.
Implementation Method 1
the top surface and at least one or more lateral surfaces can at least in parts be electrically conductive, thereby providing electromagnetic shielding for the fiber optic transceiver
Implementation Method 2
the bottom surface can comprise one or more solder pads, which can provide electrical connectivity for the fiber optic transceiver and/or that can act as heat sink to transfer heat off the fiber optic transceiver
Data Source
AI summary
A casing for housing a fiber optic transceiver for use in a fiber optic connector can include a top surface, a bottom surface and one or more lateral surfaces, wherein the top surface and at least one or more lateral surfaces are at least in parts electrically conductive, and wherein the bottom surface of the casing comprises one or more solder pads.