Fiber Optic Plate Light Emitter for Low-Crosstalk Fluorescence Detection

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Solution Overview

Problem

Conventional light-emitting elements using sapphire or GaN substrates suffer from light diffusion as waveguides, leading to crosstalk and limitations in miniaturization and efficiency, necessitating lens coupling for optical detection modules.

Innovation Solution

A light-emitting element with a fiber optic plate substrate directly bonded to a nitride semiconductor layer, eliminating waveguide diffusion and enabling efficient fluorescence collection without lens coupling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a sapphire substrate or GaN substrate with a buffer layer is used, then the light-emitting layer can be formed by crystal growth, but light beams diffuse through the substrate and buffer layer as a waveguide causing crosstalk

Engineering Contradiction:
Improvelight emission stabilityVSAvoidcrosstalk
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent removes the sapphire substrate and buffer layer from the conventional structure, extracting the waveguide effect that causes crosstalk. The light-emitting layer is directly bonded to the fiber optic plate substrate without intermediate layers, eliminating the diffusion path for light beams.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent changes the substrate material from sapphire/GaN to fiber optic plate substrate, fundamentally altering the optical properties. This parameter change transforms the substrate from a waveguide that diffuses light to a platform that enables direct fluorescence extraction without crosstalk.

Inventive Principle:
Principle #35Parameter changes

2Use of energy by moving object

If lens coupling is used in optical detection module, then light transmission can be achieved, but the detection module cannot be miniaturized and application range is restricted

Engineering Contradiction:
Improvelight transmission efficiencyVSAvoiddetection module size
Core Design Contradiction:
Use of energy by moving objectVSDevice complexity

Solution Approach 1:

The patent replaces the mechanical lens coupling system with a direct optical coupling mechanism. The fiber optic plate substrate directly receives fluorescence from the light-emitting layer, eliminating the need for lenses and associated mechanical components, thereby enabling miniaturization.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent transitions from a three-dimensional lens-based optical path to a two-dimensional direct interface between the light-emitting layer and fiber optic plate substrate. This dimensional simplification removes the need for complex lens positioning and focusing mechanisms.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Use of energy by moving object

If lens coupling is used, then light can be transmitted from light-emitting layer to optical detection module, but the efficiency of light transmission needs improvement

Engineering Contradiction:
Improvelight transmission efficiencyVSAvoidoptical alignment complexity
Core Design Contradiction:
Use of energy by moving objectVSEase of operation

Solution Approach 1:

The patent merges the light-emitting layer and fiber optic plate substrate into a directly bonded integrated structure. This consolidation eliminates the separate lens coupling interface, ensuring that all fluorescence generated in the light-emitting layer is efficiently collected by the fiber optic plate without alignment losses.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Reduces crosstalk and enhances fluorescence collection efficiency, allowing for miniaturized optical detection modules and expanded applications.

Implementation Method 1

The fiber optic plate substrate and the light-emitting layer may be bonded to each other by thermocompression bonding

Methodology Applied
Scientific EffectThermocompression bonding:

Implementation Method 2

Constituent elements of the light-emitting layer may be diffused into the fiber optic plate substrate

Methodology Applied
Scientific EffectDiffusion welding: Diffusion Welding

Implementation Method 3

a light emitter that converts incident electrons into fluorescence

Methodology Applied
Scientific EffectCathodoluminescence: Cathodoluminescence

Implementation Method 4

a nitride semiconductor layer, which is formed on one surface of the substrate and has a buffer layer and a quantum well structure for generating fluorescence in response to the incidence of electrons

Methodology Applied
Scientific EffectQuantum well structure:

Implementation Method 5

By using the fiber optic plate substrate instead of the sapphire substrate, it is possible to improve the efficiency of collecting the fluorescence generated in the light-emitting layer

Methodology Applied
Scientific EffectOptical fiber transmission: Optical Fibre

Data Source

PatentUS12495641B2Light-emitting element, optical detection module, manufacturing method for light-emitting element, and scanning electron microscope
Publication Date: 2025.12.09 HAMAMATSU PHOTONICS KK
  • US12495641B2 patent drawing
  • US12495641B2 patent drawing
  • US12495641B2 patent drawing

AI summary

There are provided a light-emitting element, an optical detection module, a method for manufacturing a light-emitting element, and a scanning electron microscope using the same, by which it is possible to reduce crosstalk and expand the range of applications. A light-emitting element includes a fiber optic plate substrate having transparency to fluorescence and a light-emitting layer as a nitride semiconductor layer having a quantum well structure. In the light-emitting element, the fiber optic plate substrate and the light-emitting layer are directly bonded to each other.