Fiber Optic Packaging with Quartz Support for Thermal Strain

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Fiber optic components in high-power fiber lasers face heating-induced strain due to back-reflected radiation and thermal expansion mismatch between metal packaging materials and fused silica components, leading to potential damage and failure.

Innovation Solution

A packaging system comprising a first support member with high thermal conductivity and a second support member made of quartz, which has a lower coefficient of thermal expansion and is resiliently mounted to minimize thermal expansion-induced strain, allowing efficient heat dissipation and strain reduction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If metal packaging materials with high thermal conductivity are used, then heat dissipation is improved, but thermal expansion mismatch with fused silica components causes heating-induced strain

Engineering Contradiction:
Improveheat dissipationVSAvoidheating-induced strain
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The packaging is divided into two distinct support members: a first support member (metal) for heat dissipation and a second support member (quartz) for strain minimization. This segmentation allows each material to perform its optimal function without compromising the other.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The second support member made of quartz acts as an intermediary between the metal first support member and the fused silica fiber optic component. This intermediary has compatible thermal expansion properties with the fiber component while being resiliently mounted to the metal structure, thereby mediating the thermal expansion mismatch.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If metal alloys with low coefficient of thermal expansion are used, then thermal expansion mismatch is reduced, but thermal conductivity decreases

Engineering Contradiction:
Improvethermal expansion mismatchVSAvoidthermal conductivity
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The packaging structure is segmented into two functional parts: the first support member made of metal with high thermal conductivity for heat dissipation, and the second support member made of quartz with low thermal expansion for compatibility with the fiber optic component.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The packaging uses a composite structure combining two different materials (metal and quartz) in the support members. This composite approach allows the system to simultaneously achieve high thermal conductivity from the metal and low thermal expansion from the quartz, resolving the trade-off between these two properties.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The packaging effectively minimizes heating-induced strain on fiber optic components by allowing the first support member to dissipate heat and reducing thermal expansion strain transfer, ensuring high reliability and cost-effectiveness.

Implementation Method 1

The first support member is adapted to exchange heat induced by free-space radiation

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a second support member (20), which is resiliently mounted to the first support member (10) for minimizing transfer of thermal expansion induced strain of the first support member (10) to the second support member (20)

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 3

a second support member (20), which is resiliently mounted to the first support member (10)

Methodology Applied
Scientific EffectResilient mounting: Elasticity

Data Source

PatentEP2663888B1Packaging for a fiber optic component and manufacturing method thereof
Publication Date: 2018.03.14 ROFIN SINAR LASER
  • EP2663888B1 patent drawingFigure 1
  • EP2663888B1 patent drawingFigure 2

AI summary

The present invention provides a packaging (1) for a fiber optic component (30), such as an optical fiber, wherein the heating induced strain to the fiber optic component (30) is minimized, wherein the packaging (1) comprises a first support member (10) having a first coefficient of thermal expansion (ki). The packaging (1) further comprises a second support member (20), which is resilient ly mounted to the first support member (10) for minimizing transfer of thermal expansion induced strain of the first support member (10) to the second support member (20). The second support member (20) comprises a longitudinal groove (21) open at least on one side of the second support member (20) for receiving a fiber optic component (30), wherein the second support member (20) has a tensile strength considerably higher than that of the fiber optic component (30). The second support member (20) has a second coefficient of thermal expansion (k2) substantially smaller than the first coefficient of thermal expansion (k1), wherein the first support member (10) is adapted to exchange heat induced by free-space radiation. The second support member (20) is made of material, such as quartz, which is transparent to the wavelengths used in the component (30)