Fiber Optic Sub-Assembly Low Profile TIR Integration
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Solution Overview
Problem
Traditional copper cables have limited transmission distance and flexibility at high data rates, making them unsuitable for consumer electronics, and existing fiber optic sub-assemblies with TIR sub-assemblies have a high profile that restricts the placement of passive devices, leading to increased signal losses.
Innovation Solution
A fiber optic sub-assembly with a TIR sub-assembly integrated into a printed circuit board, where the active devices are offset towards the lower surface, allowing lenses to be positioned closer to the active devices and reducing the overall stack height, enabling closer placement of passive devices and improving signal-to-noise performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the TIR sub-assembly is integrated into the printed circuit board, then the overall stack height is reduced, but the placement of passive devices becomes more constrained
Solution Approach 1:
The patent transitions from a planar arrangement of components to a three-dimensional integration within the printed circuit board. The TIR sub-assembly is positioned such that its optical path extends through the thickness of the board, utilizing the Z-dimension to reduce overall stack height while maintaining functional requirements. This dimensional change allows passive devices to be placed on opposite sides of the board, effectively resolving the space constraint.
Solution Approach 2:
The TIR sub-assembly is nested within the printed circuit board structure, with the optical path routed through the board's thickness. This nesting approach allows the TIR sub-assembly to be accommodated within the existing board footprint without increasing the overall profile height, thereby reducing stack height while maintaining placement flexibility for passive devices.
2Loss of energy
If lenses are positioned closer to active devices, then signal losses are reduced, but the overall assembly size decreases
Solution Approach 1:
The patent replaces traditional mechanical mounting arrangements with an integrated optical path design where lenses are positioned close to active devices through the printed circuit board's three-dimensional structure. This substitution of mechanical arrangement with optical path optimization enables reduced signal losses while maintaining compact assembly size through efficient space utilization.
Solution Approach 2:
The patent changes the spatial parameters of the optical components by positioning lenses at reduced distances from active devices. This parameter change is achieved through the three-dimensional integration within the printed circuit board, allowing closer component placement that reduces signal losses while maintaining acceptable assembly size through optimized spatial arrangement.
3Reliability
If passive devices are placed closer together, then signal integrity is improved, but manufacturing complexity increases
Solution Approach 1:
The patent segments the assembly into distinct functional zones: the TIR sub-assembly with active devices in one region and passive devices in another region. This segmentation allows passive devices to be placed close together for improved signal integrity while maintaining separate manufacturing zones that simplify the fabrication process. The clear functional separation reduces manufacturing complexity despite close placement of passive devices.
Solution Approach 2:
The patent incorporates preliminary alignment features and pre-positioned mounting structures within the printed circuit board design. These preliminary actions facilitate the accurate placement of passive devices close together while simplifying the manufacturing process. The pre-planned positioning structures ensure that close placement of passive devices does not significantly increase manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The reduced stack height and improved placement of passive devices enhance signal integrity and reduce signal losses, allowing for higher data rates and flexibility in consumer electronics applications.
Implementation Method 1
an optical turning member configured to change the direction of the optical path
Implementation Method 2
a lens configured to collect the light emitted by or concentrate the light directed to the active device
Implementation Method 3
TIR sub-assembly has a nominal height between lowermost and uppermost portions thereof
Data Source
AI summary
A fiber optic sub-assembly includes a printed circuit and a TIR sub-assembly supported by the printed circuit board. The printed circuit board includes opposed first and second surfaces and has a printed circuit board height defined by the distance between the first and second surfaces. The TIR sub-assembly has a nominal height between lowermost and uppermost portions thereof. The TIR sub-assembly is at least partially integrated into the printed circuit board so that an overall stack height of the printed circuit board and TIR sub-assembly is less than the sum of the printed circuit board height and nominal height of the TIR sub-assembly.