Automatic Fiber Placement Head Single Cutter Mechanism
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Solution Overview
Problem
Current automated fiber placement machines are complex, large, and heavy, making them unsuitable for small composite laminate assemblies and applications requiring high placement resolution, and are also expensive due to their complexity.
Innovation Solution
A simplified automatic fiber placement apparatus with a single cutting mechanism that simultaneously cuts all tape strips, reducing mechanical complexity and size while allowing for contoured or ramped tape patterns through sequential starting of individual tape strips and simultaneous cutting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple independent cutting mechanisms are used for each tape strip, then each tape strip can be cut independently, but the device becomes complex, large, and heavy
Solution Approach 1:
The patent merges multiple independent cutting mechanisms into a single cutting mechanism that can simultaneously cut all tape strips. The cutting mechanism includes a single cutter that moves across the width of the band to cut all tapes at once, eliminating the need for separate cutters for each tape strip. This reduces device complexity while maintaining the ability to cut tapes independently through controlled activation.
Solution Approach 2:
The single cutting mechanism is designed to perform the function of multiple cutters by being able to cut all tape strips simultaneously. The cutter can be activated to cut any number of tapes in the band, providing universal cutting capability across all tape positions without requiring dedicated cutters for each position.
2Adaptability or versatility
If multiple independent cutting mechanisms are used for each tape strip, then each tape strip can be cut independently, but the size and weight of the placement head increase
Solution Approach 1:
The patent merges multiple independent cutting mechanisms into a single cutting mechanism that can simultaneously cut all tape strips. The cutting mechanism includes a single cutter that moves across the width of the band to cut all tapes at once, eliminating the need for separate cutters for each tape strip. This reduces device complexity while maintaining the ability to cut tapes independently through controlled activation.
3Device complexity
If a single cutting mechanism is used to cut all tape strips simultaneously, then device complexity is reduced, but the ability to achieve high placement resolution may be compromised
Solution Approach 1:
The patent employs dynamic control of the single cutting mechanism to achieve precise placement. The cutter can be selectively activated to cut specific tapes at specific positions along the band, allowing for high placement resolution. The system dynamically controls which tapes are cut and where, maintaining precision despite using a single cutting mechanism.
Solution Approach 2:
The patent uses preliminary action by sequentially starting the placement of individual tape strips before cutting. The tapes are laid down in a controlled sequence with staggered starts, and then the single cutting mechanism cuts them at the appropriate position. This preliminary positioning ensures high placement resolution is achieved before the cutting operation.
4Adaptability or versatility
If current complex placement heads are used, then operational flexibility is maintained, but they are expensive
Solution Approach 1:
The patent merges multiple independent cutting mechanisms into a single cutting mechanism that can simultaneously cut all tape strips. The cutting mechanism includes a single cutter that moves across the width of the band to cut all tapes at once, eliminating the need for separate cutters for each tape strip. This reduces device complexity while maintaining the ability to cut tapes independently through controlled activation.
Solution Approach 2:
The single cutting mechanism is designed to perform the function of multiple cutters by being able to cut all tape strips simultaneously. The cutter can be activated to cut any number of tapes in the band, providing universal cutting capability across all tape positions without requiring dedicated cutters for each position.
Data Source
AI summary
A method of forming a composite layup on a substrate comprises: moving an automatic fiber placement head over the substrate; using the fiber placement head to lay down multiple, parallel strips of composite tape on the substrate, including staggering the start of at least certain of the tape strips so as to form a contour pattern; and, cutting the ends of all of the tape strips using a single cut.