Fiber Optic Temperature Probe Cooling for High-Temperature Chambers
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Solution Overview
Problem
Existing temperature probes used in processing chambers are limited to operating below 250 degrees, which is insufficient for high-temperature deposition processes like chemical vapor deposition that can reach up to 1000 degrees, leading to degradation and fluctuations affecting material properties and gas flow uniformity.
Innovation Solution
Integration of substrate supports with active or passive heat transfer components and high-temperature resistant phosphor ceramic cores for temperature probes, allowing for active or passive cooling and heating, enabling temperature measurements in high-temperature environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If stationary temperature probes are used in high-temperature processing chambers, then temperature monitoring is achieved, but the probes degrade due to high temperatures and temperature fluctuations
Solution Approach 1:
A heat transfer fluid serves as an intermediary between the high-temperature processing chamber environment and the temperature probe. The fluid circulates through conduits in the substrate support, absorbing heat from the high-temperature zone and transporting it away, thereby creating a protected thermal environment for the probe while still enabling temperature measurement of the processing chamber
Solution Approach 2:
The patent replaces direct thermal contact between the probe and the high-temperature chamber environment with a fluid-based heat transfer system. Instead of the probe directly measuring chamber temperature, it measures the temperature of the heat transfer fluid that has been thermally coupled to the chamber through the substrate support, substituting a mechanical/probe-based system with a fluid-mediated thermal transfer system
2Measurement precision
If fiber optic temperature probes are used, then temperature measurement is achieved, but they are limited to operation below 250 degrees and cannot handle chemical vapor deposition processes reaching up to 1000 degrees
Solution Approach 1:
The heat transfer fluid acts as a thermal intermediary that decouples the probe's operational temperature limits from the processing chamber's temperature requirements. The probe operates safely within its limited temperature range by measuring fluid temperature, while the fluid itself experiences the full temperature range through its thermal coupling with the substrate support in the processing chamber
Solution Approach 2:
The system changes the thermal parameters experienced by the probe by introducing a heat transfer fluid with appropriate thermal properties. The fluid's heat capacity, thermal conductivity, and flow rate are optimized to transfer sufficient heat from the high-temperature chamber to the probe while maintaining the probe within its safe operating temperature range, effectively expanding the system's operational temperature range beyond the probe's inherent limits
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables stable temperature monitoring and process control in high-temperature processing chambers, improving process stability and extending the operational range of temperature probes beyond conventional limits.
Implementation Method 1
The active heat transfer component comprises at least one conduit extending around an outer surface of the support bottom. The at least one conduit has an inlet end and an outlet end and configured to provide a flow of heat transfer fluid.
Implementation Method 2
Integration of substrate supports with active or passive heat transfer components and high-temperature resistant phosphor ceramic cores for temperature probes
Data Source
AI summary
Apparatus and systems for temperature probe integration on pedestal heaters of a processing chamber including a cooling assembly for cooling temperature probes disposed within. Cooling assemblies can be actively water-cooled, passively cooled by fin stacks. Further cooling assemblies include a mechanical arm assembly for lowering or raising the temperature probes.