Fiber-Reinforced Semiconductor Casing for Breakage Containment
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Solution Overview
Problem
Existing semiconductor devices face reliability issues due to high voltage and current, leading to potential breakage, hot air ejection, and dimensional restrictions that hinder downsizing and design flexibility.
Innovation Solution
A semiconductor device design featuring a first frame surrounding the semiconductor chip and a second frame with an exterior wall and a fibrous reinforcing member wound on its circumference, enhancing rupture strength and preventing bursting from impacting the outside.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thickness of the ceramic casing is increased to prevent breakage, then reliability is improved, but the inner diameter is reduced and design flexibility is restricted
Solution Approach 1:
The invention uses a composite structure combining ceramic material and fiber reinforcement. The fiber is embedded in the ceramic casing to create a composite material that maintains the ceramic's protective properties while adding tensile strength to prevent breakage, thereby improving reliability without restricting design flexibility
Solution Approach 2:
The fiber reinforcement is selectively applied to specific regions of the ceramic casing where stress concentration occurs during breakage. This localized reinforcement prevents catastrophic failure while maintaining the overall design flexibility and inner diameter of the casing
2Strength
If the inner diameter of the ceramic casing is reduced to increase thickness, then breakage resistance is improved, but the semiconductor device cannot be downsized
Solution Approach 1:
By incorporating fiber reinforcement into the ceramic casing, the structure achieves enhanced strength without increasing thickness. This allows the casing to maintain its protective function while keeping the overall device size reduced, enabling downsizing without compromising strength
3Reliability
If a protective sheath is added to trap broken pieces, then reliability is improved, but device complexity increases
Solution Approach 1:
The protective function is merged with the casing structure itself by embedding fiber reinforcement within the ceramic material. This integration eliminates the need for separate protective sheaths or containment structures, reducing device complexity while maintaining or improving reliability
Solution Approach 2:
The fiber-ceramic composite structure inherently provides both protective and containment functions, eliminating the need for additional protective components and simplifying the overall device architecture
Data Source
AI summary
A semiconductor device includes: an inner frame that surrounds an outer circumference of a semiconductor chip; and an outer frame that surrounds an outer circumference of the inner frame; wherein the outer frame is configured with an exterior wall that surrounds the outer circumference of the inner frame, and a fibrous reinforcing member that is wound on an outer circumference of the exterior wall. This prevents the broken pieces of a component that constitutes the semiconductor device from being scattered outside the semiconductor device, thereby not only to achieve improvement in the reliability of the entire system, but also to achieve downsizing of the semiconductor device.