Patterned fiber substrate
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Solution Overview
Problem
Existing methods for forming fine wiring patterns on substrates are complicated, limit pattern design freedom, and result in substrates with low bending resistance, while multilayer circuit boards face challenges in applying conductive materials to via holes with small diameters and high aspect ratios.
Innovation Solution
A patterned fiber substrate is produced by forming a lyophilic region on the fiber substrate, applying a functional material solution or dispersion to this region, and removing the solvent, allowing the functional material to penetrate inside the substrate, resulting in a fine pattern with excellent bending resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a high-viscosity conductive ink is screen-printed to reduce bleeding, then the spreading of conductive ink is improved, but the wiring pattern can only be formed on the surface of the substrate resulting in low bending resistance
Solution Approach 1:
The patent transitions from two-dimensional surface patterning to three-dimensional subsurface patterning by controlling conductive ink penetration depth. The conductive ink is made to penetrate into the fiber substrate to a controlled depth (e.g., 1-10 μm) rather than remaining only on the surface, thereby achieving both fine pattern precision and improved bending resistance through depth-based distribution.
Solution Approach 2:
The patent applies different concentrations or properties of conductive ink to different regions: the surface region maintains low conductivity to preserve pattern definition, while the subsurface region contains higher conductivity to ensure electrical function and bending resistance. This local differentiation resolves the contradiction between pattern precision and mechanical reliability.
2Manufacturing precision
If an underlayer is added to prevent spreading of conductive ink, then the pattern precision is improved, but the production method becomes complicated and thinness of the wiring structure is impaired
Solution Approach 1:
The patent removes the underlayer component entirely and replaces it with a controlled penetration mechanism. By adjusting ink viscosity, substrate porosity, and penetration depth parameters, the patent achieves pattern precision without requiring an additional underlayer structure, thereby simplifying the production method and maintaining substrate thinness.
Solution Approach 2:
The patent controls pattern precision by changing parameters such as conductive ink viscosity, substrate porosity, and penetration depth rather than adding structural components. This parameter-based control approach eliminates the need for complex underlayer structures and reduces production complexity.
3Strength
If conductive yarn is woven into the fiber substrate, then the wiring structure is formed, but the degree of freedom in pattern design is limited
Solution Approach 1:
The patent replaces the mechanical weaving process with a direct penetration and deposition process. Conductive ink is applied and penetrates the fiber substrate to form wiring patterns, eliminating the constraints of yarn-based mechanical construction. This allows for complex, continuous, and free-form patterns that cannot be achieved through traditional weaving methods.
4Reliability
If conventional methods are used to apply conductive material to via holes with small diameters and high aspect ratios, then multilayer electrical connection is achieved, but the process becomes complicated and requires advanced techniques
Solution Approach 1:
The patent uses the fiber substrate itself as an intermediary medium that facilitates conductive material penetration. The controlled porosity and structure of the fiber substrate act as a natural guide and support for the conductive ink, enabling it to penetrate vertically through multiple layers without requiring complex via hole formation processes or advanced application techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables the production of a patterned fiber substrate with a fine pattern and improved bending resistance using a wide range of functional materials, and facilitates the creation of multilayer circuit boards without the need for via holes.
Implementation Method 1
the fiber substrate has a contact angle of 100 to 170° with pure water on its surface
Implementation Method 2
at least a part of the functional material that constitutes the pattern is present in inside of the fiber substrate
Data Source
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AI summary
The present invention relates to a patterned fiber substrate comprising: a fiber substrate; and a pattern consisting of a functional material and formed on the fiber substrate, wherein at least a part of the functional material that constitutes the pattern is present in inside of the fiber substrate, the fiber substrate has a contact angle of 100 to 170° with pure water on its surface, and the pattern has a narrowest line width of 1 to 3000 µm.