Passive Optical Fiber Alignment Device with Hard Stop Features
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Solution Overview
Problem
Conventional optical fiber alignment methods for photonic integrated circuits (PICs) lack a hermetic seal and hard stop alignment features, leading to inefficiencies in alignment and sealing processes.
Innovation Solution
A passive optical fiber alignment device with a base featuring a groove for the optical fiber, alignment features for hard stop abutment, bonding pads for adhesive bonding, and a cavity for electronic components, decoupling alignment from the PIC and providing hermetic sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If v-grooves are used to passively align optical fiber to PIC, then alignment is simplified, but hermetic seal and hard stop alignment features are lost
Solution Approach 1:
The invention separates the alignment function from the PIC device by introducing a独立的alignment device with v-grooves. This alignment device is bonded to the PIC, providing passive alignment capabilities while the PIC itself remains unchanged. The segmentation allows the alignment features to be decoupled from the optical waveguide structure.
Solution Approach 2:
The alignment device acts as an intermediary between the optical fiber and the PIC. It provides the v-groove passive alignment features and hard stop alignment mechanisms, while being bonded to the PIC through bonding pads. This intermediary structure enables both passive alignment and hermetic sealing without modifying the PIC itself.
2Measurement precision
If active alignment with epoxying or laser welding is used, then alignment precision is improved, but process complexity and time increase
Solution Approach 1:
The alignment device is pre-configured with v-grooves and hard stop alignment features before bonding to the PIC. The v-grooves are precisely formed in advance to provide passive alignment, eliminating the need for complex active alignment procedures during assembly. This preliminary preparation of alignment features simplifies the overall process.
Solution Approach 2:
The v-groove structure provides self-aligning capability where the optical fiber naturally settles into the groove position, achieving precise alignment without requiring complex active adjustment mechanisms. The hard stop features provide automatic positioning, allowing the system to self-align during bonding without external intervention.
3Adaptability or versatility
If alignment features are integrated into PIC, then device integration is improved, but manufacturing complexity and lack of hermetic seal increase
Solution Approach 1:
The invention divides the system into two independent components: the PIC and the alignment device. This segmentation allows each component to be manufactured separately using optimized processes, with the alignment device containing all alignment and sealing features. The separate manufacturing reduces PIC complexity while maintaining integration through bonding.
Solution Approach 2:
The alignment device serves multiple functions simultaneously: it provides passive alignment through v-grooves, hermetic sealing through the bonded interface, hard stop alignment features, and mechanical support. This multi-functionality in a single component simplifies the overall device architecture and manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves precise, hermetically sealed alignment of optical fibers to PICs with sub-micron accuracy, enhancing the reliability and yield of optical fiber connections while preventing adhesive interference.
Implementation Method 1
first bonding pads mounted on the base for bonding with corresponding second bonding pads on the PIC via a bonding material disposed therebetween
Data Source
AI summary
A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.