Field Guided Post Exposure Bake Process Cell
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Solution Overview
Problem
In photolithography processes, the reduction in integrated circuit component dimensions leads to challenges such as low throughput, increased line edge roughness, and decreased resist sensitivity, primarily due to non-uniform electric field strengths across the photoresist layer, which affect acid generation and deprotection rates, resulting in patterning inaccuracies.
Innovation Solution
A substrate processing apparatus and method that includes an electrode assembly with an intermediate medium between the photoresist layer and the electrode to maintain a uniform electric field, reducing line edge/width roughness and improving sensitivity by controlling the diffusion of charged species, and optimizing the distance and orientation between the electrode and the substrate to minimize bubble formation and enhance field uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If small wavelength lithography is used to reduce minimum printable size, then manufacturing precision is improved, but productivity decreases and line edge roughness increases
Solution Approach 1:
An intermediate medium is introduced between the electrode and the photoresist layer to mediate the electric field interaction. This intermediate medium allows the electrode to be positioned closer to the photoresist layer without direct contact, enabling stronger electric fields that enhance acid generation and improve patterning precision while maintaining process stability and throughput
2Manufacturing precision
If electrode assembly is used to generate electric field for improving resolution, then manufacturing precision is improved, but non-uniform electric field strength causes line edge roughness
Solution Approach 1:
The intermediate medium serves as a mediator that distributes the electric field more uniformly across the photoresist layer. By positioning the electrode closer to the photoresist layer through this intermediate medium, the electric field strength is enhanced while the intermediate medium itself helps to equalize field distribution, reducing variations that cause line edge roughness
Solution Approach 2:
The system applies localized electric field enhancement precisely where needed - at the interface between the electrode and photoresist layer. The intermediate medium enables this localized enhancement while the overall field distribution remains controlled and uniform, creating optimal conditions for acid generation in the photoresist without causing non-uniformities
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces line edge/width roughness and enhances the accuracy and sensitivity of the photoresist layer during post-exposure development, improving the overall resolution and productivity of photolithography processes.
Implementation Method 1
Electrode assemblies are utilized to generate and deliver an electric field to a photoresist layer disposed on the substrate prior to or after an exposure process so as to modify chemical properties of a portion of the photoresist layer
Implementation Method 2
The photoacid generator, upon exposure to electromagnetic radiation in a subsequent exposure stage, alters the solubility of the photoresist in the development process. Exposure to light decomposes the photo acid generator, which generates acid
Implementation Method 3
After exposure, the substrate is heated in a post-exposure bake process. During the post-exposure bake process, the acid generated by the photoacid generator reacts with the resist resin, changing the solubility of the resist
Data Source
AI summary
Apparatus and method for substrate processing are described herein. More specifically, the apparatus and method are directed towards apparatus and method for performing a field guided post exposure bake operation on a semiconductor substrate. The apparatus is a processing module (100) and includes an upper portion (102) with an electrode (400) and a base portion (104) which is configured to support a substrate (500) on a substrate support surface (159). The upper portion (102) and the base portion (104) are actuated toward and away from one another using one or more arms (112) and form a process volume (404). The process volume (404) is filled with a process fluid and the processing module (100) is rotated about an axis (A). An electric field is applied to the substrate (500) by the electrode (400) before the process fluid is drained from the process volume (404).