Filament Confinement in 3D Non-Volatile Memory

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Solution Overview

Problem

High-density non-volatile memory devices, such as resistive random-access memory (RRAM), face variations in filament formation and destruction processes, leading to undesirable variations in resistance states and switching voltages, which affect their programming efficiency.

Innovation Solution

A memory device structure comprising an electrode stack with side surfaces and a conformal switching layer, where the electrode stack includes a first electrode, a first hard mask, a second electrode, a second hard mask, and a third electrode, with the switching layer covering the side surfaces to facilitate controlled filament formation and destruction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If higher-density memory structures are used, then memory density increases, but filament formation and destruction variations increase

Engineering Contradiction:
Improvememory densityVSAvoidfilament formation consistency
Core Design Contradiction:
Quantity of substanceVSManufacturing precision

Solution Approach 1:

The patent introduces a conformal switching layer that uniformly covers the side surfaces of the electrode stack, creating a localized confined region for filament formation. This local structural modification ensures that filaments form only within the defined switching layer boundaries, preventing lateral spread and improving consistency in filament formation and destruction processes, thereby resolving the manufacturing precision issue while maintaining high memory density

Inventive Principle:
Principle #3Local quality

2Quantity of substance

If higher-density memory structures are used, then memory density increases, but resistance value variations increase

Engineering Contradiction:
Improvememory densityVSAvoidresistance value consistency
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The conformal switching layer creates a localized confined region that restricts filament formation to specific areas, preventing lateral spread. This local confinement ensures more uniform resistance values across different memory cells, improving reliability while maintaining high density

Inventive Principle:
Principle #3Local quality

3Quantity of substance

If higher-density memory structures are used, then memory density increases, but switching voltage variations increase

Engineering Contradiction:
Improvememory densityVSAvoidswitching voltage consistency
Core Design Contradiction:
Quantity of substanceVSEase of operation

Solution Approach 1:

The conformal switching layer establishes a well-defined confined region for filament formation, creating more uniform switching characteristics. This local structural control reduces variations in switching voltages required to program memory cells, improving ease of operation while maintaining high memory density

Inventive Principle:
Principle #3Local quality

4Quantity of substance

If filament spread occurs, then memory density can be increased, but resistance state variations worsen

Engineering Contradiction:
Improvememory densityVSAvoidresistance state consistency
Core Design Contradiction:
Quantity of substanceVSManufacturing precision

Solution Approach 1:

The conformal switching layer acts as a physical barrier that confines filaments to a specific region, preventing lateral spread. This local confinement ensures that even at high memory density, filaments maintain consistent formation and destruction patterns, preserving resistance state consistency and manufacturing precision

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the consistency and speed of switching between high and low resistance states, improving the programming efficiency and reliability of the memory device.

Implementation Method 1

a switching voltage may be applied so as to form one or more filaments within the resistive element, creating a conductive path across the resistive element to provide a low resistance state

Methodology Applied
Scientific EffectFilament formation:

Implementation Method 2

a switching voltage may be applied to destroy the filaments, thereby removing the conductive path to provide a high resistance state

Methodology Applied
Scientific EffectFilament destruction:

Data Source

PatentUS20230200091A1Three-dimensional non-volatile memory device with filament confinement
Publication Date: 2023.06.22 GLOBALFOUNDRIES SINGAPORE PTE LTD
  • US20230200091A1 patent drawing
  • US20230200091A1 patent drawing
  • US20230200091A1 patent drawing

AI summary

A non-volatile memory device and method of making the same is provided. The memory device includes a first electrode, a first hard mask on the first electrode, a second electrode on the first hard mask, a second hard mask on the second electrode, and a third electrode on the second hard mask. A switching layer is over the electrode stack and the switching layer has a first portion conformal to the side surfaces of the electrode stack.